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Exposure of 895i resist using a vector scan Gaussian electron-beam lithography system

机译：使用矢量扫描高斯电子束光刻系统曝光895I抗蚀剂

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Abstract not available.

机译：摘要不可用。

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来源
《Conference on Photomask and X-ray mask technology》|1996年||共9页
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作者
Sheldon M. Kugelmass; Joseph Mitchell; John T. Poreda;
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中图分类自动化技术、计算机技术;
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机译：电子扫描和电子束光刻系统中基于图像的硅光电二极管基于图像的原位电子束漂移检测
2. Three-dimensional electron energy deposition modeling of cathodoluminescence emission near threading dislocations in gan and electron-beam lithography exposure parameters for a PMMA resist [J] . Demers H., Poirier-Demers N., Phillips M.R., Microscopy and microanalysis: The official journal of Microscopy Society of America, Microbeam Analysis Society, Microscopical Society of Canada . 2012,第6期

机译：PMMA抗蚀剂的gan螺纹位错附近的阴极发光发射的三维电子能量沉积模型和电子束光刻曝光参数
3. Estimation of resist profile for line/space patterns using layer-based exposure modeling in electron-beam lithography [J] . Q. Dai, S.-Y. Lee, S.H. Lee, Microelectronic Engineering . 2011,第6期

机译：在电子束光刻中使用基于层的曝光模型估算线/空间图案的抗蚀剂轮廓
4. Exposure of 895i resist using a vector scan Gaussian electron-beam lithography system [C] . Sheldon M. Kugelmass, Lepton Inc., Murray Hill, Photomask and X-Ray Mask Technology III . 1996

机译：使用矢量扫描高斯电子束光刻系统曝光895i抗蚀剂
5. Thermomechanical distortions of electron-beam projection lithographic mask systems during exposure. [D] . Lee, Po-Tung. 2003

机译：电子束投影光刻掩模系统在曝光期间的热机械变形。
6. Single-Digit Nanometer Electron-Beam Lithography with an Aberration-Corrected Scanning Transmission Electron Microscope [O] . Fernando E. Camino, Vitor R. Manfrinato, Aaron Stein, 2018

机译：单数字纳米电子束光刻和像差校正扫描透射电子显微镜
7. Single-Digit Nanometer Electron-Beam Lithography with an Aberration-Corrected Scanning Transmission Electron Microscope [O] . Fernando E. Camino, Vitor R. Manfrinato, Aaron Stein, 2018

机译：具有像差校正扫描透射电子显微镜的单位数字纳米电子束光刻
8. Scanning Probe Lithography. 1. Scanning Tunneling Microscope-Induced Lithography of Self-Assembled n-Alkanethiol Monolayer Resists. [R] . Ross, C. B., Sun, L., Crooks, R. M. 1993

机译：扫描探针光刻。 1.扫描隧道显微镜诱导的自组装正烷硫醇单层抗蚀剂的光刻。

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