Room-temperature interconnection of electroplated Au microbump bymeans of surface activated bonding method

摘要

Although various bonding methods have been developed for flip-chipassembly, most of them cannot be applied to smaller pitchinterconnection for the next generation. In the present study, a newbonding method, the surface activated bonding (SAB) is introduced. Thefeasibility of the SAB for bump bonding was investigated by someexperiments. The Au electroplated bumps were prepared for experiments.The three different types of material, Au, Cu, and Al were used ascontact metals. The reliability of interconnections was tested intemperature storage. As a result, we could achieved the bonding ofmicrobumps with high strength and good electrical connection. It wasalso found that in the case of bump bonding, SAB can be done underrelatively high vacuum pressure condition