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Electronic Components and Technology Conference, 2001. Proceedings., 51st

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1.Predicting solder joint reliability for thermal, power, and bendcycle within 25 accuracy

机译：预测焊点在热，功率和弯曲方面的可靠性循环精度在25％以内
- 作者：Syed A.
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
2.Evaluation of lead(Pb)-free ceramic ball grid array (CBGA):Wettability, microstructure and reliability

机译：无铅陶瓷球栅阵列（CBGA）的评估：润湿性，微观结构和可靠性
- 作者：Farooq M.;Ray S.;Sarkhel A.;Goldsmith C.
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
3.The effect of variations in nickel/gold surface finish on theassembly quality and attachment reliability of a plastic ball grid array

机译：镍/金表面光洁度变化对镀层的影响塑料球栅阵列的装配质量和连接可靠性
- 作者：Coyle R.J.;Wenger G.M.;Hodges D.E.;Mawer A.;Cullen D.P.;Solan P.P.
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
4.Effects of microvia build-up layers on the solder joint reliabilityof a wafer level chip scale package (WLCSP)

机译：微孔堆积层对焊点可靠性的影响晶圆级芯片规模封装（WLCSP）
- 作者：Lau J.H.;Lee S.-W.R.
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
5.Wide area vertical expansion (WAVE^TM) package design forhigh speed application: reliability and performance

机译：广域垂直扩展（WAVE ^{TM ）包装设计高速应用：可靠性和性能}
- 作者：Young-Gon Kim;Mohammed I.;Byong-Su Seol;Teck-Gyu Kang
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
6.Coupled thermal electric-modeling of flexible nanospringinterconnects for high-performance probing

机译：柔性纳米弹簧的耦合热电模型用于高性能探测的互连
- 作者：Ahmad M.;Sitaraman S.K.
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
7.Development of electroless Ni/Au plated build-up flip chip packagewith highly reliable solder joints

机译：化学镀Ni / Au积层倒装芯片封装的开发具有高度可靠的焊点
- 作者：Yokomine K.;Shimizu N.;Miyamoto Y.;Iwata Y.;Love D.;Newman K.
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
8.Constitutive behaviour of lead-free solders vs. lead-containingsolders-experiments on bulk specimens and flip-chip joints

机译：无铅焊料与含铅焊料的本构行为大块试样和倒装焊点上的焊料实验
- 作者：Wiese S.;Schubert A.;Walter H.;Dukek R.;Feustel F.;Meusel E.;Michel B.
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
9.Selection of base substrate material for design against interfacialdelamination for a multilayered system-on-package (SOP) structure

机译：选择用于抗界面设计的基础基材材料多层系统级封装（SOP）结构的分层
- 作者：Weidong Xie;Hurang Hu;Sitaraman S.K.
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
10.Underfilled BGAs for a variety of plastic BGA package types and theimpact on board-level reliability

机译：底部填充的BGA，适用于各种塑料BGA封装类型和对板级可靠性的影响
- 作者：Burnette T.;Johnson Z.;Koschmieder T.;Oyler W.
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
11.A design and manufacturing solution for high-reliable, non-leadedCSPs like QFN

机译：高可靠，无铅的设计和制造解决方案QFN等CSP
- 作者：Kuhnlein G.
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
12.mm-wave microstrip and novel slot antennas on low cost large areapanel MCM-D substrates-a feasibility and performance study

机译：低成本大面积毫米波微带和新型缝隙天线面板MCM-D基材-可行性和性能研究
- 作者：Grzyb J.;Cottet D.;Troster G.
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
13.Comparison of multilayer organic and ceramic package simultaneousswitching noise measurements using a 0.16 μm CMOS test chip

机译：多层有机和陶瓷封装同时比较使用0.16μmCMOS测试芯片进行开关噪声测量
- 作者：Budell T.;Audet J.;Kent D.;Libous J.;OConnor D.;Rosser S.;Tremble E.
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
14.Electronic packaging and interconnection techniques, education atuniversity level-a Romanian experience

机译：电子封装和互连技术，教育大学水平-罗马尼亚经验
- 作者：Svasta P.;Codreanu N.-D.;Ionescu C.;Golumbeanu V.
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
15.Effects of O₂/C₂F₆ plasma descumwith RF cleaning on via formation in MCM-D substrate usingphotosensitive BCB

机译：O _{2 / C _{2 F _{6 血浆除渣的作用使用以下方法在MCM-D基板上的通孔形成上进行RF清洁感光BCB}}}
- 作者：Chul-Won Ju;Seong-Su Park;Seong-Jin Kim;Kyu-Ha Pack;Hee-Tae Lee;Min-Kyu Song
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
16.Adhesion/reliability/reworkability study on underfill material fromfree radical polymerization system and its hybrid composite with epoxyresin

机译：底部填充材料的附着力/可靠性/可返工性研究自由基聚合体系及其与环氧树脂的杂化复合材料树脂
- 作者：Lianhua Fan;Wong C.P.
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
17.Advanced packaging technologies on 3D stacked LSI utilizing themicro interconnections and the layered microthin encapsulation

机译：利用3D堆叠LSI的先进封装技术微互连和分层微薄封装
- 作者：Tomita Y.;Morifuji T.;Ando T.;Tago M.;Kajiwara R.;Nemoto Y.;Fujii T.;Kitayama Y.;Takahashi K.
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
18.Reliability study and failure analysis of fine pitch solder bumpedflip chip on low-cost printed circuit board substrate

机译：细间距焊锡凸块的可靠性研究和故障分析低成本印刷电路板基板上的倒装芯片
- 作者：Guo-Wei Xiao;Chan P.C.H.;Teng A.;Lee P.S.W.;Yuen M.M.F.
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
19.Virtual thermo-mechanical prototyping of electronic packagingchallenges in material characterization and modeling

机译：电子包装的虚拟热机械原型材料表征和建模方面的挑战
- 作者：Zhang G.Q.;Tay A.A.O.;Ernst L.J.;Liu S.;Qian Z.F.;Bressers H.J.L.;Janssen J.
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
20.A silicon optical bench approach to low cost high speedtransceivers

机译：硅光学平台方法可实现低成本高速收发器
- 作者：Goodrich J.
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
21.A fluxless Sn-In bonding process achieving high remeltingtemperature

机译：无熔剂锡铟键合工艺，实现高度重熔温度
- 作者：Chuang R.W.;Choe S.;Lee C.C.
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
22.Room-temperature interconnection of electroplated Au microbump bymeans of surface activated bonding method

机译：电镀金微凸块的室温互连。表面活化键合方法
- 作者：Matsuzawa Y.;Itoh T.;Suga T.
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
23.Surface mountable package (OptoBGATM) for 10 G data link

机译：用于10 G数据链路的可表面安装的封装（OptoBGA TM ）
- 作者：Kishida Y.;Niwa Y.;Kuba Y.;Komeda K.;Setoguchi K.;Matsubara T.;Yanagisawa M.;Tanahashi S.
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
24.Embedded TiNxOy thin-film resistors in a build-up CSP for 10 Gbpsoptical transmitter and receiver modules

机译：内置CSP的TiNxOy薄膜电阻器，可实现10 Gbps光学发射器和接收器模块
- 作者：Shibuya A.;Matsui K.;Takahashi K.;Kawatani A.
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
25.A study of underlayer geometry effects on interconnect linecharacteristics through S-parameter measurements

机译：底层几何形状对互连线的影响研究通过S参数测量获得的特性
- 作者：Jae-Kyung Wee;Young-Hee Kim;Yong-Ju Kim;Pil-Soo Lee;Yong-Je Jeon;Jo-Han Kim;Han-Sub Yoon;Jin-Yong Chung
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
26.A Wide Area Vertical Expansion (WAVETM) packagingprocess development

机译：广域垂直扩展（WAVE TM ）包装工艺开发
- 作者：Delin Li;Light D.;Castillo D.;Beroz M.;Nguyen M.;Wang T.
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
27.A hands-on multi-disciplinary product development course for microsystems packaging education at Georgia Tech

机译：Micro的动手多学科产品开发课程佐治亚理工学院的系统包装教育
- 作者：Bhattacharya S.K.;Hobbs J.M.;Varadarajan M.;Sanchez O.;Tummala R.R.;May G.S.
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
28.A study of normal, restoring, and fillet forces and solder bumpgeometry during reflow in concurrent underfill/reflow flip chip assembly

机译：研究法向力，恢复力和圆角力以及焊锡凸点同时进行的底部填充/回流倒装芯片组装中回流期间的几何形状
- 作者：Renzhe Zhao;Yun Zhang;Johnson R.W.;Harris D.K.
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
29.Self-alignment feasibility study and contact resistance improvementof electrically conductive adhesives (ECAs)

机译：自对准可行性研究和接触电阻改善导电胶（ECA）的制造
- 作者：Jiali Wu;Kyoung-Sik Moon;Wong C.P.
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
30.Improvement of the reliability of the C4 for ultrahigh thermalconduction module with the direct solder-attached cooling system (DiSAC)

机译：提高C4的超高温可靠性带有直接焊接的冷却系统（DiSAC）的传导模块
- 作者：Yamada O.;Sawada Y.;Harada M.;Yokozuka T.;Yasukawa A.;Moriya H.;Saito N.;Kasai K.;Uda T.;Netsu T.;Koyano K.
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
31.Highly alignment tolerant InGaAs inverted MSM photodetectorheterogeneously integrated on a differential Si CMOS receiver operatingat 1 Gbps

机译：高度对准公差的InGaAs倒置MSM光电探测器异构集成在差分Si CMOS接收器上以1 Gbps的速度
- 作者：Vrazel M.;Jae Joon Chang;In-Dal Song;KeeShik Chung;Brooke M.;Jokerst N.M.;Brown A.;Wills D.S.
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
32.Development of new no-flow underfill materials for both eutecticsolder and a high temperature melting lead-free solder

机译：新型共晶的无流动底部填充材料的开发焊料和高温熔化的无铅焊料
- 作者：Haiying Li;Wong C.P.
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
33.On the effect of system constraints on mechanical integrity of highdensity packages used in telecommunication applications

机译：关于系统约束对高机械完整性的影响电信应用中使用的高密度封装
- 作者：Langari A.R.;Morris W.L.;Kuhlman M.;Hashemi H.S.;Dadkhah M.S.
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
34.Investigation of low cost flip chip under bump metailization (UBM)systems on Cu pads

机译：凸块化（UBM）下低成本倒装芯片的研究铜垫上的系统
- 作者：Jae-Woong Nab;Kyung-Wook Paik
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
35.MEMS technology-micromachines enabling the “all opticalnetwork”

机译：MEMS技术-微型机器实现“全光学网络”
- 作者：Robinson S.D.
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
36.Experimental analysis of design options for spiral inductorsintegrated on low cost MCM-D substrates

机译：螺旋电感器设计方案的实验分析集成在低成本MCM-D基板上
- 作者：Cottet D.;Grzyb J.;Scheffler M.;Troster G.
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
37.Study of the interface microstructure of Sn-Ag-Cu lead-free soldersand the effect of solder volume on intermetallic layer formation

机译：Sn-Ag-Cu无铅焊料的界面微观结构研究以及焊料量对金属间层形成的影响
- 作者：Salam B.;Ekere N.N.;Rajkumar D.
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
38.Studies on Ni-Sn intermetallic compound and P-rich Ni layer at theelectroless nickel UBM-solder interface and their effects on flip chipsolder joint reliability

机译：Ni-Sn金属间化合物和富磷Ni层的研究化学镍UBM-焊料界面及其对倒装芯片的影响焊点可靠性
- 作者：Young-Doo Jeon;Kyung-Wook Paik;Kyoung-Soon Bok;Woo-Suk Choi;Chul-Lae Cho
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
39.Solder parameter sensitivity for CSP life-time prediction usingsimulation-based optimization method

机译：使用CSP寿命预测的焊料参数敏感性基于仿真的优化方法
- 作者：Vandevelde B.;Beyne E.;Zhang K.;Caers J.
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
40.New structure 1608 size chip tantalum capacitor -6.3 WV-10 μFwith face-down terminals for fillet-less surface mounting

机译：新结构的1608尺寸片状钽电容器-6.3 WV-10μF带正面朝下的端子，用于无圆角表面安装
- 作者：Shirashige M.;Oka K.;Okada K.
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
41.Flip chip assembly process development, reliability assessment andprocess characterization for polymer stud grid array-chip scale package

机译：倒装芯片组装工艺开发，可靠性评估和螺柱网格阵列芯片级封装的工艺表征
- 作者：Paydenkar C.S.;Jefferson F.G.;Baldwin D.F.
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
42.Modelling and characterisation of the polymer stud grid array(PSGA) package: electrical, thermal and thermo-mechanical qualification

机译：聚合物螺柱网格阵列的建模与表征（PSGA）封装：电气，热和热机械认证
- 作者：Arun Chandrasekhar;Vandevelde B.;Driessens E.;Pieters P.;Beyne E.;De Raedt W.;Nauwelaers B.;Van Puymbroeck J.
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
43.Microstructure, joint strength and failure mechanism of Sn-Ag,Sn-Ag-Cu versus Sn-Pb-Ag solders in BGA packages

机译：Sn-Ag的组织，结合强度和破坏机理，BGA封装中的Sn-Ag-Cu和Sn-Pb-Ag焊料
- 作者：Ka Yau Lee;Ming Li;Olsen D.R.;Chen W.T.;Tan B.T.C.;Mhaisalkar S.
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
44.Closed-form representations for triangle impulse responsesassociated with single and coupled lossy transmission lines

机译：三角冲激响应的闭式表示与单线和耦合有损传输线相关
- 作者：Tingdong Zhou;Dvorak S.L.;Prince J.L.
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
45.Precision motion control system for ultra-precision semiconductorand electronic components manufacturing

机译：超精密半导体的精密运动控制系统和电子零件制造
- 作者：Tan K.K.;Dou H.F.;Tang K.Z.
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
46.Design and packaging challenges for on-board cache subsystems usingsource synchronous 400 Mb/s interfaces

机译：使用板载高速缓存子系统的设计和包装挑战源同步400 Mb / s接口
- 作者：Nam Pham;Cases M.;Guertin D.
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
47.High reliable and environmental friendly molding compound forCABGA(R) packages

机译：高可靠和环保的模塑料用于CABGA（R）软件包
- 作者：Byung-Seon Kong;Hyo-Chang Yun;Jong-Chan Lim;Yeon-Su Jung;Dong-Young Kim;Kwan-Seek Chung
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
48.Deformation and crack growth characteristics of SnAgCu vs 63Sn/Pbsolder joints on a WLP in thermal cycle testing

机译：SnAgCu与63Sn / Pb的变形和裂纹扩展特征热循环测试中WLP上的焊点
- 作者：Deok-Hoon Kim;Elenius P.
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
49.A study of electromigration in 3D flip chip solder joint usingnumerical simulation of heat flux and current density

机译：利用3D倒装芯片焊点电迁移的研究。热流和电流密度的数值模拟
- 作者：Lee T.-Y.T.;Taek Yeong Lee;King-Ning Tu
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
50.A study on the effectiveness of dummy pattern design existence inmulti-layer PBGA application

机译：虚拟模式设计存在的有效性研究。多层PBGA应用
- 作者：Kim S.J.;Sohn E.S.;Wang G.H.;Son S.J.;Chung K.S.;Lee C.H.
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
51.Design and thermo-mechanical analysis of a Dimple-ArrayInterconnect technique for power semiconductor devices

机译：酒窝阵列的设计和热力学分析功率半导体器件的互连技术
- 作者：Wen S.S.;Huff D.;Guo-Quan Lu
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
52.Evaluation of commercially available, thick, photosensitive filmsas a stress compensation layer for wafer level packaging

机译：评估市售的厚感光膜作为晶圆级封装的应力补偿层
- 作者：Keser B.;Prack E.R.;Fang T.
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
53.Moisture blocking planes and their effect on reflow performance inachieving reliable Pb-free assembly capability for PBGAs

机译：防潮层及其对回焊性能的影响实现可靠的PBGA无铅组装能力
- 作者：Shook R.L.;Gerlach D.L.;Vaccaro B.T.
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
54.Advances in long-wavelength single-mode VCSELs and packagingapproaches for single-mode fiber applications

机译：长波长单模VCSEL和封装的进展单模光纤应用的方法
- 作者：Coldren L.A.;Hall E.;Nakagawa S.
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
55.AMP Z-pack 2 mm HM connectors with quiet mate contacts forresolution of nanosecond discontinuity in hot-swap applications

机译：AMP Z-pack 2 mm HM连接器，带有安静的配合触点，用于热插拔应用中纳秒不连续性的分辨率
- 作者：Demirci H.H.;Laub M.;Fry C.
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
56.Electronics packaging-a graduate course for Rutgers UniversitySchool of Electrical and Computer Engineering

机译：电子包装-罗格斯大学研究生课程电气与计算机工程学院
- 作者：Caggiano M.F.
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
57.High K polymer-ceramic nano-composite development,characterization, and modeling for embedded capacitor RFapplication

机译：高钾聚合物陶瓷纳米复合材料的开发，嵌入式电容器RF的特性和建模应用
- 作者：Yang Rao;Jireh Yue;Wong C.P.
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
58.New developments in single pass reflow encapsulant for flip chipapplication

机译：倒装芯片单程回流密封剂的新发展应用
- 作者：Liu J.;Kraszewski R.;Xin Lin;Wong L.;Goh S.H.;Allen J.
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
59.Lead free interfacial structures and their relationship to Auplating including accelerated thermal cycle testing of non-leaden BGAspheres

机译：无铅界面结构及其与金的关系电镀，包括无铅BGA的加速热循环测试领域
- 作者：Taguchi T.;Kato R.;Akita S.;Okuno A.;Suzuki H.;Okuno T.
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
60.Combined experimental and numerical investigation on flip chipsolder fatigue with cure-dependent underfill properties

机译：倒装芯片的实验与数值研究相结合焊料疲劳和固化相关的底部填充性能
- 作者：Yang D.G.;Zhang G.Q.;Ernst L.J.;Caers J.F.J.;Bressers H.J.L.;Janssen J.
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
61.Novel thermal validation metrology based on non-uniform powerdistribution for Pentium(R) III XeonTM cartridge processordesign with integrated level two cache

机译：基于非均匀功率的新型热验证计量奔腾（R）III Xeon TM 盒式处理器的发行版集成二级缓存的设计
- 作者：Teck Joo Goh;Amir A.N.;Chia-Pin Chiu;Torresola J.
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
62.Microwave frequency model of wafer level package and increasedloading effect on Rambus memory module

机译：晶圆级封装的微波频率模型及其增强在Rambus内存模块上的加载效果
- 作者：Junwoo Lee;Baekkyu Choi;Seungyoung Ahn;Woonghwan Ryu;Jae Myun Kim;Kwang Seong Choi;Joon-Ki Hong;Heung-Sup Chun;Joungho Kim
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
63.Relationships between suspension formulations and the properties ofBaTiO₃/epoxy composite films for integral capacitors

机译：悬浮液配方与酚醛树脂性能之间的关系集成电容器用BaTiO _{3 /环氧复合膜}
- 作者：Sung-Dong Cho;Kyung-Wook Paik
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
64.Pico-second signal transient characterization technique of meandersthrough s-parameter measurement in high-speed PWB interconnects

机译：曲折的皮秒信号瞬态表征技术高速PWB互连中通过s参数测量
- 作者：Yong-Ju Kim;Jo-Han Kim;Hyo-Seog Ryu;Young-Suk Suh;Jae-Kyung Wee;Heung-Sup Chun;Joong-Sik Ki
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
65.Dual operational amplifier using flip-chip fine package of1.0×1.0×0.6-mm with 8-pin counts

机译：双运放采用倒装芯片精封装1.0×1.0×0.6mm，带8针计数
- 作者：Kurata H.;Mitsuka K.;Matsushita H.
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
66.3.125 Gbps/channel 4-channel parallel optical transmitter andreceiver module with MT-RJ receptacle

机译：3.125 Gbps /通道4通道并行光发射机和带有MT-RJ插座的接收器模块
- 作者：Yoneda I.;Yamauchi K.;Yunoki S.;Matsumoto K.;Nakamura T.;Miyoshi K.;Nagahori T.
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
67.High speed multichip modules using flip chip mount technology for10 Gbps optical transmission systems

机译：使用倒装芯片安装技术的高速多芯片模块10 Gbps光传输系统
- 作者：Takahashi K.;Ikeuchi T.;Tsuda T.;Chuzenji T.
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
68.Evaluation and optimization of package processing, design, andreliability through solder joint profile prediction

机译：评估和优化包装处理，设计和通过焊点轮廓预测获得可靠性
- 作者：Yeung B.H.;Lee T.-Y.T.
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
69.Solder joint crack propagation in plastic and ceramic packageddiodes mounted on insulated metal substrate

机译：焊点在塑料和陶瓷包装中的裂纹扩展安装在绝缘金属基板上的二极管
- 作者：Sangalli N.;Barker D.B.
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
70.Progress on Internet-based educational material development forelectronic products and systems cost analysis

机译：基于互联网的教育材料开发的进展电子产品和系统成本分析
- 作者：Sandborn P.;Murphy C.F.
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
71.The kinetics of formation of ternary intermetallic alloys in Pb-Snand Cu-Ag-Sn Pb-free electronic joints

机译：Pb-Sn中三元金属间化合物形成的动力学和Cu-Ag-Sn无铅电子接头
- 作者：Zribi A.;Zavalij L.;Borgesen P.;Primavera A.;Westby G.;Cotts E.J.
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》
72.Low loss deep glass waveguides produced with dry silverelectromigration process

机译：用干银制成的低损耗深玻璃波导电迁移过程
- 作者：Chuang R.W.;Lee C.C.
- 会议名称：《Electronic Components and Technology Conference, 2001. Proceedings., 51st》