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Impact of InxGa1?x composition and source Zn diffusion temperature on intrinsic voltage gain in InGaAs TFETs

机译:Inxga1的影响和源Zn扩散温度对Ingaas TFET中的内在电压增益

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This work reports for the first time on the experimental study of the intrinsic voltage gain of InGaAs nTFET. The influence of Indium/Gallium composition and Zn diffusion temperature is analyzed. For a higher Indium amount (In0.7Ga0.3As compared to In0.53Ga0.47As) the band to band tunneling (BTBT) is improved due to bandgap narrowing. A higher Zn diffusion temperature gives rise to a higher source doping, resulting in a smaller tunneling length, which also increases BTBT. In both devices the intrinsic voltage gain is improved. One interesting characteristic of these devices is that they present good analog performance at low voltages (VGS=VDS=0.6V), which is promising for low power/low voltage analog applications. High-temperature operation increases in all cases more the output conductance than the transconductance, resulting in a lower intrinsic voltage gain.
机译:这项工作首次报告了InGaAsNTFET内在电压增益的实验研究。分析了铟/镓组合物和Zn扩散温度的影响。对于更高的铟量(与IN0.7GA0.3As相比,与IN0.53GA0.47AS相比)由于带隙变窄而改善了带隧道隧道(BTBT)的带。较高的Zn扩散温度产生更高的源掺杂,导致较小的隧道长度,这也增加了BTBT。在两种设备中,内在电压增益得到改善。这些设备的一个有趣特性是它们在低电压(VGS = VDS = 0.6V)下存在良好的模拟性能,这对低功率/低电压模拟应用是有希望的。高温操作在所有情况下增加,输出电导比跨导更多,导致较低的内在电压增益。

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