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Impact of InxGa1−x composition and source Zn diffusion temperature on intrinsic voltage gain in InGaAs TFETs

机译:InGaAs TFET中InxGa1-x成分和源极Zn扩散温度对本征电压增益的影响

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This work reports for the first time on the experimental study of the intrinsic voltage gain of InGaAs nTFET. The influence of Indium/Gallium composition and Zn diffusion temperature is analyzed. For a higher Indium amount (In0.7Ga0.3As compared to In0.53Ga0.47As) the band to band tunneling (BTBT) is improved due to bandgap narrowing. A higher Zn diffusion temperature gives rise to a higher source doping, resulting in a smaller tunneling length, which also increases BTBT. In both devices the intrinsic voltage gain is improved. One interesting characteristic of these devices is that they present good analog performance at low voltages (VGS=VDS=0.6V), which is promising for low power/low voltage analog applications. High-temperature operation increases in all cases more the output conductance than the transconductance, resulting in a lower intrinsic voltage gain.
机译:这项工作首次报道了InGaAs nTFET的固有电压增益的实验研究。分析了铟/镓组成和锌扩散温度的影响。对于更高的铟含量(In0.7Ga0.3As与In0.53Ga0.47As相比),由于带隙变窄,带间隧穿(BTBT)得到改善。较高的Zn扩散温度导致较高的源极掺杂,从而导致较小的隧穿长度,这也增加了BTBT。在这两种器件中,固有电压增益均得到改善。这些器件的一个有趣的特性是,它们在低电压(VGS = VDS = 0.6V)时表现出良好的模拟性能,这对于低功耗/低压模拟应用是有前途的。在所有情况下,高温工作都会增加输出电导,而不是跨导增加,从而导致较低的固有电压增益。

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