Review on the high temperature warpage measurement using shadow moiré

摘要

Recently, the members of Jedec committee tried to publish new warpage spec criteria for high temperature to reduce SMT quality issue (open/short) during the reflow on the purpose of the development and the qualification of a component. In order to verify the repeatability and reliability of warpage data with shadow moire, the study on high temperature warpage measurement was performed. From this study, it was found that the warpage could be changed by various measurement parameters such as ramp rate, sample preparation, setup condition even though the JEDEC (JESD22B112) and JEITA (ED-7306) specification was fully followed. Finally, in this paper, we tried to suggest the best known method considering key experimental factors which could affect the warpage in view point of high temperature warpage measurement.