Fundamentals in Bottom Anti-Reflective Coating Design For Its successful Integration Into i-line and DUV Manufacturing

摘要

As manufacturing lines are moving to produce higher functionality integrated circuits [ICs], the minimum critical dimension [CD] must be reduced. There becomes a point when the CD being printed is the same as the wavelength used to define the photolithographic image. Since lithography tools have a considerable cost, IC manufacturers now routinely employ the equipment for feature sizes below the wavelength of light. As the wavelength of light is reduced, the reflection from the substrate increases which degrades the process window. By introducing BARC technology, it is possible to extend the lifetime of these tools and expand the process window by eliminating back reflections from the substrate. This technology coupled with advanced illumination settings can yield successful lithography beyond the exposure wavelength.