The study of the convex corner compensation in anisotropic wet etching of (100) Si in aqueous KOH

机译：KOH水溶液中（100）Si各向异性湿法腐蚀中凸角补偿的研究

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The method of convex corner compensation with <100> bar for silicon presented by G.K.Mayer, etc. has been investigated. the limitations of the method is indicated , and a modified method is put forward.

机译：研究了G.K. Mayer等人提出的用<100> bar的硅凸角补偿方法。指出了该方法的局限性，提出了一种改进的方法。

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《International conference on solid-state and integrated circuit technology》|1995年|498-500|共3页
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Qingxin Zhang; Litian Liu; Zhijian Li;
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中图分类微电子学、集成电路（IC）;
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1. A simple approach to convex corner compensation in anisotropic KOH etching on a (100) silicon wafer [J] . Fan W, Zhang DC Journal of Micromechanics and Microengineering . 2006,第10期

机译：在（100）硅晶片上进行各向异性KOH蚀刻的凸角补偿的简单方法
2. EFFECTS OF [110]-ORIENTED CORNER COMPENSATION STRUCTURES ON MEMBRANE QUALITY AND CONVEX CORNER INTEGRITY IN (100)-SILICON USING AQUEOUS KOH [J] . Vankampen RP., Wolffenbuttel RF. Journal of Micromechanics and Microengineering . 1995,第2期

机译：[110]取向的角补偿结构对KOH水溶液对（100）硅中膜质量和凸角完整性的影响
3. EFFECTS OF [110]-ORIENTED CORNER COMPENSATION STRUCTURES ON MEMBRANE QUALITY AND CONVEX CORNER INTEGRITY IN (100)-SILICON USING AQUEOUS KOH [J] . Vankampen RP., Wolffenbuttel RF. Journal of Micromechanics and Microengineering . 1995,第2期

机译：[110]取向的角补偿结构对KOH水溶液对（100）硅中膜质量和凸角完整性的影响
4. The study of the convex corner compensation in anisotropic wet etching of (100) Si in aqueous KOH [C] . Qingxin Zhang, Litian Liu, Zhijian Li International conference on solid-state and integrated-circuit technology; 19951024-28; Beijing(CN) . 1995

机译：KOH水溶液中（100）Si各向异性湿法腐蚀中凸角补偿的研究
5. Anisotropic etching of polymer films by high energy (approximately 100s of eV) oxygen atom neutral beams [D] . Panda, Siddhartha 1999

机译：高能（约100s eV）氧原子中性束对聚合物膜的各向异性刻蚀
6. Two-Layer Microstructures Fabricated by One-Step Anisotropic Wet Etching of Si in KOH Solution [O] . Han Lu, Hua Zhang, Mingliang Jin, 2016

机译：KOH溶液中Si的一步各向异性湿法腐蚀制备的两层微结构
7. A Comprehensive Review on Convex and Concave Corners in Silicon Bulk Micromachining based on Anisotropic Wet Chemical Etching [O] . Pal P, Sato K 2015

机译：基于各向异性湿化学刻蚀的硅块体微加工中凹凸角的综述
8. Technique for protecting chip corners in wet chemical etching of silicon wafers [R] . Hui, W. C. 1991

机译：在硅晶片的湿化学蚀刻中保护芯片角的技术

The study of the convex corner compensation in anisotropic wet etching of (100) Si in aqueous KOH

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