Investigation on thermal properties of substrates for printed electronics

摘要

Printed Electronics is today an emerging technology with potential for many applications, having as target the low cost market. Although many applications are operating with low level of currents and voltages and hence thermal issues don't arise, there are some applications that imply thermal stressing of these substrates, for instance gas sensors. This paper presents an essay for establishing a measurement procedure for thermophysical properties of thin polymer foils, more precisely the thermal conductivity in steady state thermal regime [1]. For comparison, thermal conductivity of substrates with known thermal conductivity is measured supplemental, using a laboratory thermal conductivity meter.