chemical interdiffusion; copper alloys; current density; failure analysis; integrated circuit interconnections; Cusub3/subSn; Kirkendall voids; bump resistance; current density; current stressing; current-induced failures; electromigration behavior; failure mechanism; fine pitch chip-to-substrate interconnect; intermetallic compound formation; microbump; porosities; temperature 150 degC; time 2000 hour; Compounds; Current density; Electromigration; Intermetallic; Resistance; Substrates; Tin;
机译:凸块冶金学下细间距Cu / Sn-3.5Ag支柱节点在Cu / Zn和Cu / Ni上的界面反应
机译:连接到OSP和ENEPIG基板上的Cu支柱凸点电迁移引起的失效研究
机译:连接到OSP和ENEPIG基板上的Cu支柱凸点的电迁移诱导失效研究
机译:微距芯片与基板互连微凸块Cu柱电迁移行为的研究
机译:使用细间距互连(≤10μm)的硅 - 互连织物上的异质整合(≤10μm)
机译:微波评估高级互连中的电迁移敏感性
机译:新型低批量焊盘工艺精细间距Cu柱凹槽互连