fine-pitch technology; flip-chip devices; integrated circuit bonding; integrated circuit interconnections; integrated circuit packaging; lead bonding; low-power electronics; reflow soldering; three-dimensional integrated circuits; 2.5D fine pitch copper pillar bump interconnections; 3D IC packages; TSV interposer; bonding substrate; capillary underfill process; electronic package design; flip-chip bonder; molded underfill process; portable electronic devices; power consumption; solder joint formation; solder reflow process; thermocompression bonding; through silicon via; Bonding; Flip-chip devices; Silicon; Soldering; Through-silicon vias;
机译:一种新型的中介层的制造和电学特性,该中介层具有用于2.5D / 3D应用的具有超低电阻率的直通硅通孔(TSV)的聚合物衬里和硅柱
机译:键合参数对微间距Cu / Ni / SnAg微凸点微芯片芯片间互连可靠性的影响
机译:用于40微米凸块间距的基于面板的玻璃插入器的细间距和高速再分配层的设计与演示
机译:TSV插入器上的2.5D细间距铜柱凹凸折叠的热压缩键合
机译:具有金属和聚合物键合界面的芯片封装纳米结构铜和镍互连。
机译:高电阻Si插入器的RF冗余TSV互连
机译:新型低批量焊盘工艺精细间距Cu柱凹槽互连