Impact of Sn3.0Ag0.5Cu solder powder size on the reliability of solder joints in high density led packages

摘要

Improving the reliability of solder joints is an urgent issue to guarantee the quality of surface assembly products. The size of components and pitches on the circuit board differs from each other which leads to the size of solder joints variation one by one. In this study, the size effect of solder powder on Sn-3.0Ag-0.5Cu solder joints in high density LED display packaging was investigated. The microstructure and shear stress of the solder joints were observed as-reflowed and after different thermal cycling period conditions. The study suggested that the type 3 solder joint had good reliability and mechanical property than others. So the type 3 Sn-3.0Ag-0.5Cu solder powder was recommended the best to package this high density LED display.