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International Conference on Electronic Packaging Technology and High Density Packaging

召开年：2012
召开地：Guilin(CN)
出版时间：-

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1.Study on the electrodeposition of Fe-Ni UBM films in modified watts bath

机译：改性瓦斯浴中Fe-Ni UBM膜电沉积的研究
- 作者：Zhang Hao;Zhang Li;Duan Zhenzhen;Lai Chi-Ming;Liu Zhi-Quan
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
2.Study on interfacial behavior and shear strength of lead-free micro-interconnect bump after SnPb reballing

机译：SNPB REBLATING后无铅微互连凸起的界面行为和剪切强度研究
- 作者：Zhou Bin;Zhou Qing;En Yun-fei
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
3.Fabrication of wafer-level spherical Rb vapor cells for miniaturized atomic clocks by a chemical foaming process

机译：用化学发泡工艺制备用于小型化原子钟的晶片级球形RB蒸气细胞
- 作者：Wei Wenlong;Shang Jintang;Kuai Wenlin;Qin Shunjin;Wang Tingting;Chen Jie
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
4.Interfacial reaction of heat-sink during vacuum and reflow soldering in space power electronics

机译：空间动力电子吸水过程中散热器的界面反应
- 作者：Chen Yarong;Yang Meng;Zhang Binbin;An Rong
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
5.The reliability evaluation of the bonding wire in the DC/DC power under the environment of humidity

机译：湿度环境下DC / DC功率中粘合线的可靠性评价
- 作者：Zhang Xiaowen;He Xiaoqi
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
6.Analysis on the failure modes and mechanisms of LED packaging

机译：LED包装的故障模式和机制分析
- 作者：Liu Xin;Fang Wenxiao
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
7.Design and analysis of 2D embedded passive devices in printed circuit boards

机译：印刷电路板2D嵌入式无源器件的设计与分析
- 作者：Zhang Jing;Li Baoxia;Lixiwan;Cao Liqiang
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
8.Leakage failure analysis of nickel-copper gas-proof material used in traveling-wave tube

机译：行波管中使用的镍铜防空材料泄漏故障分析
- 作者：Zhang Chengshi;Bao Shengxiang;Zhang Xiaowen;Wang Zuwen;Li Peng;Gui Long
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
9.A buffered distributed spray MOCVD reactor design

机译：缓冲分布式喷雾MOCVD反应器设计
- 作者：Hu Shaolin;Gan Zhiyin;Yan Han;Liu Sheng
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
10.Void free filling of TSV vias by bottom up copper electroplating for wafer level MEMS vacuum packaging

机译：通过底部向上填充TSV通孔的无效填充晶片电平MEMS真空包装
- 作者：Xu Chunlin;Wang Xuefang;Wang Yuzhe;Xu Minghai;Hu Chang;Liu Sheng
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
11.Rapid thermal cycling by eddy current inducted heating on optical property and thermostability of high power LED

机译：通过涡流电流加热对光学性能的快速热循环和高功率LED的热稳定性
- 作者：Chen Jibing;Guo Wei;Liu Yinong;Zhang Wenfei;An Bing;Wu Yiping
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
12.Random vibration simulation and analysis of PoP solder joints with different structure parameters

机译：不同结构参数的随机振动模拟与分析流行焊点
- 作者：Tang Haili;Wu Zhaohua;Lui Zhengwei
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
- FEM structure parameter;
- package-on-package;
- random vibration;
13.Study of magnetic properties for iron core in a closed loop hall current sensor

机译：闭环厅电流传感器中铁芯磁性研究
- 作者：Cheng Xingguo;Zhang Zongyang;Li Fuan;Liu Sheng
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
- Current Sensor;
- Magnetic Property;
- Modeling and Simulation;
14.Dual-band bandpass filter design using composite Right/Left-Handed materials

机译：双带带通滤波器设计使用复合右/左手材料
- 作者：Wang Liuping;Wan Lixi;Cao Liqiang
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
15.Failure analyse of the welding point in flip-chip BGA packages in the drop-free

机译：倒装芯片BGA封装中焊接点的故障分析
- 作者：Yuan Guozheng;Bai Chuang;Shu Xuefeng
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
16.Microstructural evolution of Sn single grain microbumps for 3D-TSV high density solder interconnection under thermal aging tests

机译：在热老化试验下3D TSV高密度焊料互连SN单粒微磁盘的微观结构演化
- 作者：Shen Xing;Wang Bo;Zhang Wenfei;An Bing;Wu Yiping
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
17.Effects of copper plating thickness of Ni/Fe alloy leadframe on the thermal performance of Small Outline Transistor (SOT) packages

机译：Ni / Fe合金引线框架铜电镀厚度对小轮廓晶体管（SOT）封装的热性能的影响
- 作者：Li Weiqiang;Chen Haibin;Han Jiale;Xue Ke;Wong Fei;Shiu Ivan;Cheng Guangxu;Wu Jingshen
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
18.Failure localization and mechanism analysis in system-on-chip (SOC) using advanced failure analysis techniques

机译：使用先进的故障分析技术在芯片系统（SOC）中的故障定位和机制分析
- 作者：Chen Yuan;Chen Hui;Zhang Xiaowen;Lai Ping
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
19.Phosphor concentration in silicone and its effect on the mechanical and interfacial properties of phosphor-filled silicone

机译：硅氧烷中的磷浓度及其对粉煤灰硅氧烷的机械和界面性能的影响
- 作者：Chen Xing;Wang Simin;Liu Xiaogang;Liu Sheng
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
20.Effects of sulfide on silver-plated lead frame on wire bonding quality

机译：硫化物对镀银框架线粘接质量的影响
- 作者：Zhang H.M;Zong F.;Hu M.;Ye D.H;He Q.C
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
21.A quick turn packaging solution and its application

机译：快速转动包装解决方案及其应用
- 作者：Guo Han;Cai Jian;Pu Yuanyuan;Chen Yu;Wang Qian;Deng Zhi;Jiang Jing;Kong Lingwen
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
22.Growth and shear strength of intermetallic compounds in Sn-Ag-Cu solder joints

机译：SN-AG-Cu焊点中金属间化合物的生长和剪切强度
- 作者：Zhu Jiandong;Wang Chunqing;Hang Chunjin;Tian Yanhong
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
23.Suppressing effect of 1 wt. nano-TiO2 addition into low Ag content Sn-Ag-Cu solder alloy on the intermetallic growth with Cu substrate during isothermal aging

机译：抑制1重量％的纳米TiO2在等温老化期间用Cu衬底进行金属间生长对低Ag含量的Sn-Ag-Cu焊接合金。
- 作者：Tsao L.C.;Huang W.T.;Wu M.W.;Su Sheng-Lung
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
24.Robustness of point light source approximation in lens design for light-emitting diode packages

机译：发光二极管包装镜头设计点光源近似的鲁棒性
- 作者：Hu Run;Zhao Zhili;Liu Sheng;Luo Xiaobing
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
25.A novel type of stacked cylindrical PoP package

机译：一种新型堆叠圆柱形流行包装
- 作者：Cheng Li-ye;Shi Ling-feng;Cai Cheng-shan;Meng Chen;Lai Xin-quan
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
26.Packaging optimization for tire pressure monitoring system

机译：轮胎压力监测系统的包装优化
- 作者：Chen Xiaojie;Zhang Zongyang;Leng Yi;Luo Zhang;Liu Sheng
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
27.Reliability assessment for LED luminaires based on Step-Stress Accelerated Life Test

机译：基于静态应力加速寿命测试的LED照明器可靠性评估
- 作者：Gong Ming;Ma Xiaosong;Yang Daoguo;Cai Miao;Zhang Zhen;Ren Rongbin;Yang Yu
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
28.Effect of dummy via on the SIV performance of narrow-wide copper interconnection

机译：虚设通孔对窄铜互连SIV性能的影响
- 作者：Lin Xiao-ling;Li Meng;Xiao Qing-zhong;Zhang Xiao-wen
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
29.Process development of a stacked chip module with TSV interconnection

机译：具有TSV互连的堆叠芯片模块的过程开发
- 作者：Zhong Xiao;Ma Shenglin;Zhu Yunhui;Bian Yuan;Sun Xin;Cui Qinghu;Miao Min;Chen Jing;Jin Yufeng
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
30.Direct robust active bonding between Al heat sink and Si substrate

机译：在Al散热器和Si衬底之间直接稳健的主动粘合
- 作者：Tsao L.C.;Chang S.Y.;Huang Meng-Syuan;Chen C.S.
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
31.The effect of different TSV electroplating levelers on the copper residual stress

机译：不同TSV电镀水平机对铜残余应力的影响
- 作者：Wu Ciyan;Feng Xue;Cao Haiyong;Ling Huiqin;Li Ming;Mao Dali
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
32.The effect of temperature on compressive mechanical behavior of SWCNT-Ni

机译：温度对SWCNT-NI压缩力学行为的影响
- 作者：Chen Youkai;Zhu Fulong;Liao Hengyou;Song Shao;Liu Sheng
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
33.Effects of ultrasonic vibration on undercooling and microstructures of SAC305 alloy

机译：超声振动对SAC305合金过冷和微观结构的影响
- 作者：Ji Hongjun;Wang Qiang;Li Mingyu
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
34.Optimal design of work stage mounting system of precision packaging equipment

机译：精密包装设备工作台安装系统的最佳设计
- 作者：Jing Hui;Li Cong;Liu Fuyun;Kuang Bing
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
35.Synthesis and characterization of ZnO nanowires by solvothermal method and fabrication of nanowire-based ZnO nanofilms

机译：溶液氧化物法制料ZnO纳米线的合成与表征，纳米线ZnO纳米叶片制备
- 作者：Chu Yanbiao;Wan Lixi;Wang Xiehuan;Zhang Jingwei
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
36.Carrierless thin wafer handling for 3D integration

机译：用于3D集成的载人薄晶片处理
- 作者：Lv Zhicheng;Yuan Jiaojiao;Fang Jing;Yan Liang;Wang Xuefang;Liu Sheng
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
37.A study of characteristics of halogen-free prevented solder materials

机译：无卤素防止焊料特性研究
- 作者：Wang Mu-Chun;Shih Tien-Tsorng;Lin Bao-Yi;Yang Hsin-Chia;Wu Yaw-Dong;Liu Chuan-Hsi
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
38.Thermal simulation and analysis of intelligent power module (IPM) package

机译：智能电源模块（IPM）包的热仿真与分析
- 作者：Liu Peisheng;Tong Liangyu;Huang Jinxin;Tao Yujuan;Shen Haijun
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
39.Study on mechanical behavior and interfacial strength of YAG phosphor-filled silicone

机译：YAG磷粉型硅氧烷的力学行为和界面强度研究
- 作者：Chen Xing;Wang Simin;Chen Fei;Zheng Huai;Liu Sheng
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
40.Dissolution of substrates in line-type Cu/Sn/Cu and Cu/Sn/Ni interconnects under current stressing

机译：在电流应力下型Cu / Sn / Cu / Cu和Cu / Sn / Ni互连中的底物溶解
- 作者：Pan Song;Huang Mingliang;Zhao Ning;Zhou Shaoming;Zhang Zhijie
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
41.A numerical method on thermal and vapor pressure effects on void growth in electronic packaging

机译：关于电子包装中空隙生长的热和蒸汽压力影响的数值方法
- 作者：Mei Yue;Zhang Xiaoqing;Zeng Xiangxin
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
42.Effect of reflow time on shear property of two-step electroplated Sn-3.5Ag solder bumps

机译：回流时间对两步电镀SN-3.5AG焊料凸块剪切性能的影响
- 作者：Zhao Qinghua;Bi Jinglin;Hu Anmin;Li Ming;Mao Dali
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
43.A highlight processing technology for SMT solder joint gray image

机译：SMT焊点灰色图像的亮点加工技术
- 作者：Liang Tianshou;Zhou Dejian;Liu Zhengwei
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
- 3D reconstruction;
- Bayesian methods;
- Highlight detection;
- Mean field;
- SMT solder joint;
44.Extraction of Anand model parameters for mixed solder material by tensile test

机译：用拉伸试验提取混合焊料材料的Anand模型参数
- 作者：Zhou Bin;Zhou Qing;Pan Kailin;Liu Ganggang
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
45.TSV interposer with Au-Au diffusion bonding technology for wafer level fabrication

机译：具有Au-Au扩散键合技术的TSV插入器，用于晶圆水平制造
- 作者：Chen Xiao;Ye Jiaotuo;Xu Gaowei;Luo Le
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
46.Advanced packaging stepper for 300mm wafer process

机译：用于300mm晶圆工艺的先进的包装步进器
- 作者：Zhou Chang;Li Zhongyu;Zhang Lei
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
47.Ceramic column grid array: A high-reliability approach for area array packaging

机译：陶瓷柱网格阵列：区域阵列包装的高可靠性方法
- 作者：Huang Yingzhuo;Jiang Xueming;Lin Pengrong;Cao Yusheng;Lian Binhao;Yao Quanbin
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
48.Dynamic model for analyzing the motion of molten solder during self-assembly

机译：用于分析自组装熔融焊料运动的动态模型
- 作者：Yang Lei;Wang Chunqing;Liu Wei;Tian Yanhong
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
49.Study on short time interfacial reactions between Sn-3.0Ag-0.5Cu solder balls and ENEPIG pads

机译：SN-3.0AG-0.5CU焊球和Enepig垫之间的短时间界面反应研究
- 作者：Yang Fan;Huang Mingliang;Zhao Ning
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
50.Analysis of POP solder ball thermal cycling fatigue life based on stress strain

机译：基于应力应变的流行焊球热循环疲劳寿命分析
- 作者：Liu Chen;Lai Xinquan;Xiao Yuanming;Shi Lingfeng;Jiang Jianguo
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
51.The effect of gelatin on the tin electrodeposition

机译：明胶对锡电沉积的影响
- 作者：Zhao Zi-Shou;Xian Ai-Ping
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
52.Torsion behavior simulation of Ni-coating SWCNT based on molecular dynamics

机译：基于分子动力学的Ni涂层SWCNT的扭转行为模拟
- 作者：Liao Hengyou;Zhu Fulong;Zhang Wei;Chen Youkai;Song Shao;Liu Sheng
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
53.An effective prediction method for LED lumen maintenance

机译：一种有效的LED腔维护预测方法
- 作者：Fan H.B.;Li X.P.;Shen J.X.;Chen M.
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
- LED;
- LM80;
- Lumen maintenance;
- WHTOL;
54.Optical design of LED packaging for concentrated and uniform lighting

机译：浓缩均匀照明的LED包装光学设计
- 作者：Zhao Shuang;Wang Kai;Chen Fei;Liu Sheng
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
55.The Study of infrared radiation thermal imaging technology for temperature testing

机译：用于温度测试的红外辐射热成像技术研究
- 作者：Song Fang fang;He Xiaoqi;Lai Ping;wang Ren
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
56.Improvement of light extraction efficiency of white LEDs using microstructure array on phosphor silicone layer

机译：使用微观结构阵列在磷光体硅层上使用微观结构阵列的改进
- 作者：Yu Shan;Hu Run;Chen Mingxiang;Liu Sheng
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
57.Topology optimization of swing-arm in LED die bonder

机译：LED模具粘合剂摇摆臂的拓扑优化
- 作者：Huang Meifa;Zhang Dawei;Wang Zhiyue;Quan Weichuang
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
- ANSYS analysis;
- Die bonding equipment;
- Swing-arm;
- Topology optimization;
58.A novel LED un-symmetrical lens for road lighting with super energy saving

机译：一种新型LED不对称镜头，具有超节能的道路照明
- 作者：Zhao Zhili;Hu Run;Wang Kai;Chen Fei;Wang Shang;Liu Sheng
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
59.The study of testing scenario for a SIP microcomputer

机译：SIP微型计算机测试场景的研究
- 作者：Liu Liangliang;Jiang Penglong;Zhao Xiongbo
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
60.Formic acid with Pt catalyst combined treatment process for Cu low temperature bonding

机译：具有Pt催化剂的甲酸组合处理方法Cu低温粘合
- 作者：Yang Wenhua;Akaike Masatake;Fujino Masahisa;Suga Tadatomo
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
61.MCM interconnect test scheme based on particle swarm optimization algorithm

机译：基于粒子群优化算法的MCM互连测试方案
- 作者：Lei Chen
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
62.A new thermally conductive thermoplastic die attach film

机译：一种新的导热热塑性模具连接膜
- 作者：Duan Yajun;Ye Lilei;Cui Huiwang;Liu Johan
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
63.Comprehensive studies on interfacial properties and microstructures of silicone used in LED packaging

机译：LED包装中使用的硅胶界面性能和微观结构的综合研究
- 作者：Wang Simin;Chen Xing;Liu Xiaogang;Chen Fei;Cao Bin;Liu Sheng
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
64.Fracture properties of Cu-EMC interfaces at harsh conditions

机译：Cu-EMC界面在恶劣条件下的裂缝性能
- 作者：Sadeghinia M.;Jansen K.M.B.;Ernst L.J.;Pape H.
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
65.A study of electrical character of 3D high-density junction capacitor for SiP

机译：SIP 3D高密度结电容器电气特性研究
- 作者：Wang Huijuan;Yu Daquan;He Ran;Cao Liqiang;Wan Lixi
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
66.The design of LED driving power based on current-double synchronous rectifier ZVZVS

机译：基于电流 - 双同步整流器ZVZV的LED驱动功率设计
- 作者：Xue Xing;Chen Weikang;Li Baoqiang
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
- Current-double;
- Phase-shift full-bridge;
- Synchronous rectification;
- ZVZCS;
67.Design of one novel LED airport runway centerline light suitable for various applications

机译：设计一部小型LED机场跑道中心线光适用于各种应用
- 作者：Ji Chuangang;Zhao Mengxiong;Peng Tao;Wang Fei;Li Cao;Liu Sheng
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
68.Design and optimization of a TSV 3D packaged pressure sensor for high temperature and dynamic measurement

机译：TSV 3D包装压力传感器的设计与优化高温动态测量
- 作者：Liu Zhenhua;Huang Xian;Zhu Zhiyuan;Chen Jing;Jin Yufeng
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
69.Formation and growth of intermetallic compounds of Sn-2Ag-2.5Zn on Cu and Ni substrates

机译：Cu和Ni衬底上的Sn-2Ag-2.5Zn金属间化合物的形成和生长
- 作者：Liu Yucheng;Luo Tingbi;Hu Anmin;Li Shangyuan;Wang Weizhen;Li Ming
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
70.Fabrication of YAG glass ceramic and its application for light emitting diodes

机译：YAG玻璃陶瓷的制造及其对发光二极管的应用
- 作者：Yang Liang;Chen Mingxiang;Yu Shan;Lv Zhicheng;Liu Sheng
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
- LED;
- Phosphor glass ceramic;
- YAG;
71.Angular color uniformity improvement for phosphor-converted white light-emitting diodes by optimizing remote coating phosphor geometry

机译：通过优化远程涂层磷几何形状，通过优化磷光转换白光二极管的角度颜色均匀性改进
- 作者：Zheng Huai;Fu Xing;Hu Run;Liu Sheng;Luo Xiaobing
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
72.Integrated wafer thinning process with TSV electroplating for 3D stacking

机译：集成晶圆减薄工艺，具有TSV电镀3D堆叠
- 作者：Li Cao;Zhou Shengjun;Chen Run;Peng Tao;Wang Xuefang;Liu Sheng
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
73.Non-destructive testing of through silicon vias by using X-ray microscopy

机译：通过使用X射线显微镜通过硅通孔的无损检测
- 作者：Jing Xiangmeng;Yu Daquan;Wang Wei;Yu Guoqing;Wan Lixi
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
74.Influence of strains on the optical properties of non-polar and semi-polar gallium nitride based LEDs

机译：菌株对非极性半极性氮化镓基LED的光学性质的影响
- 作者：Yan Han;Gan Zhiyin;Liu Sheng
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
75.Investigation of the optical properties of ZnO/epoxy resin nanocomposite: Application in the LED

机译：ZnO /环氧树脂纳米复合材料的光学性质研究：LED中的应用
- 作者：Peng Chongnan;Zhang Guoping;Sun Rong;Wong C.P.
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
76.Development of large die assembly process based on simulation and experiments of underfill materials selection

机译：基于填充材料选择的仿真和实验的大型模拟过程的开发
- 作者：Liu Xiaoyang;Wu Xiaolong;Chen Wenlu;He Ran;Yu Daquan
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
77.Theoretical study on power factor of Si/Ge multi-layer thermoelectric micro-cooler

机译：Si / GE多层热电微冷却器功率因数的理论研究
- 作者：Han Leilei;Wang Chunqing;Hang Chunjin
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
78.Numerical simulation of reheating system heat transfer coefficient with H63 brass alloy

机译：用H63黄铜合金再加热系统传热系数的数值模拟
- 作者：Wang Kaikun;He Qingluan;Li Xianhui
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
- heat transfer coefficient;
- numerical simulation;
- reheating;
- thermocouple temperature measurement method;
79.Automated IP quality qualification for efficient system-on-chip design

机译：自动化IP质量资格，用于高效的芯片设计
- 作者：Wang Li-wei;Luo Hong-wei
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
80.The copper stud bump bonding process analysis based on thermal-solid coupled simulation

机译：基于热固耦合模拟的铜柱凸块粘接工艺分析
- 作者：Zhang Shanshan;Zhang Jing
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
81.Hybrid modeling and analysis on the interfacial characteristics of Cu/Al interface structures in IC packaging with wire bonding

机译：用钢丝键合IC包装CU / Al接口结构界面特性的混合建模与分析
- 作者：Zhang Liqiang;Liu Dongjing;Chen Min;Xie Fangwei;Yu Xingang;Song Xifu;Xi Tao;Zhao Yanfang;Yang Ping
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
82.Influence of segregation and diffusion behavior on electrical properties of embedded Ni- Cr thin film resistor

机译：隔离和扩散行为对嵌入式Ni-Cr薄膜电阻器电性能的影响
- 作者：Lai Lifei;Sun Rong;Fu Xianzhu;Du Ruxu
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
83.Carbon aerogel /polyaniline composite as supercapacitors packaging applications

机译：碳气凝胶/聚苯胺复合材料作为超级电容器包装应用
- 作者：Chen Fengyin;Gui Dayong;Ding Sheng;Zhu Yifeng;Liu Jianhong
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
- Carbon Aerogel;
- Composite;
- Polyaniline;
- Supercapacitors;
84.Comparative analysis of reliability between dual-row and conventional QFN packages

机译：双排与QFN包装之间可靠性的比较分析
- 作者：Xia Guofeng;Qin Fei;Zhu Wenhui;Ma Xiaobo;Gao Cha
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
- Dual-row QFN;
- Fatigue Life;
- Thermal Performance;
- Warpage;
85.Microstructure and mechanical properties of lead-free PV ribbon

机译：无铅PV带的微观结构和力学性能
- 作者：Wu Xuewei;Ding Dongyan;Han Bai;Mao Dali
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
86.Failure mode of SAC305 lead-free solder joint under thermal stress

机译：在热应力下SAC305无铅焊点的故障模式
- 作者：Huang Chao;Yang Daoguo;Wu Boyi;Liang Lili;Yang Yu
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
- Sn-3Ag-0.5Cu;
- crack;
- failure mode;
- thermal aging;
- thermal cycling;
87.Processing performance and microstructure of Sn-Zn based solders modified by Bi and mixed rare earth elements

机译：Bi和混合稀土元素改性Sn-Zn基焊料的处理性能和微观结构
- 作者：Huang Jia-Qiang;Zhou Min-Bo;Li Chang-Zheng;Ma Xiao;Zhang Xin-Ping
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
88.Study of 3-D staking assembly based on the package material of PCB

机译：基于PCB封装材料的3-D铆接组装研究
- 作者：Lu Yu-zhong;Jiang Jian-guo;Lai Xin-quan;Wang Xiu;Huang Zhan-wu
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
89.Wettability transition of nickel films with micro-nano cones array

机译：微纳米锥形阵列镍膜的润湿性转变
- 作者：Geng Wenyan;Wang Haozhe;Hu Anmin;Li Ming
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
90.Research on electroplating process of SiC/Al electronic packaging composites

机译：SiC / Al电子包装复合材料电镀过程研究
- 作者：Wang Kaikun;Du Jianquan;Yang Lei
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
- Coating morphology;
- EDX;
- Electroless nickel plating;
- Gold plating;
- SiC/Al composites;
91.A study of novel wafer level LED package based on TSV technology

机译：基于TSV技术的新型晶圆LED封装研究
- 作者：Chen Dong;Zhang Li;Xie Ye;Tan KH;Lai CM
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
- LED package;
- Wafer level;
- remote phosphor;
- through silicon via;
92.A novel shielding structure based on TSV 3D package

机译：基于TSV 3D封装的新型屏蔽结构
- 作者：Li Jun;Wan Lixi;Cao Liqiang
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
93.Preparation of VACNT TIM by a novel metallization and chemical bonding process

机译：一种新的金属化和化学粘合工艺制备VACNT蒂姆
- 作者：Wang Tingting;Shang Jintang;Liu Jingdong
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
94.Effect of additives on copper electroplating profile for TSV filling

机译：添加剂对TSV填充铜电镀型材的影响
- 作者：Zhu Yunhui;Bian Yuan;Sun Xin;Ma Shenglin;Cui Qinghu;Zhong Xiao;Chen Jing;Miao Min;Jin Yufeng
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
95.Fabrication of a glass microfluidic device integrated with ultrasonic resonators

机译：与超声谐振器集成的玻璃微流体装置的制造
- 作者：Kuai Wenlin;Shang Jintang;Wei Wenlong;Qin Shunjin;Wang Tingting;Chen Jie;Zhang Li;Lai CM
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
96.Liquid optically clear adhesives for display applications

机译：液体光学透明粘合剂用于显示应用
- 作者：Lu D.;Wang J.;Li C.;Yuan J.;Sawanobori J.;Lin J.;Litke A.;Levandoski M.
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
97.Effects of cooling rate on microstructure and microhardness of lead-free Sn-3.0Ag-0.5Cu solder

机译：冷却速率对无铅SN-3.0AG-0.5CU焊料微观结构和显微硬度的影响
- 作者：Wei Guoqiang;Wang Lei
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
- cooling rate;
- lead-free solder;
- microhardness;
- microstructure;
98.Thermal characterization of high power LED array in aluminum base copper clad laminate package

机译：铝基铜包层压包装件中大功率LED阵列的热表征
- 作者：Hang Chunjin;Fei Jingming;Wang Hong;Wang Chunqing
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
99.Degradation detecting of solder joints by time domain reflectometry technology

机译：时域反射尺寸技术降解检测焊点
- 作者：Lu Yu-Dong;Wan Ming;Yao Bin
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年
100.Structural and compositional optimization of advanced fan-in WLCSPs base on FEA simulation

机译：高级粉丝在FEA模拟中的高级扇形粉丝结构和组成优化
- 作者：Guo Hong Yan;Qin Shun Jin;Zhang Li;Tan KH;Lai CM
- 会议名称：《International Conference on Electronic Packaging Technology and High Density Packaging》 | 2012年