Overview on Thermal and Mechanical Challenges of High Power RF Electronic Packaging

摘要

High Power RF electronics is one of the essentialparts for wireless communication, including thepersonal communication, broadcasting, microwaveradar, etc. Moreover, high efficient high powerelectronics has entered the ISM market, such as thepower generator of microwave oven.Power electronics requires a close co-development ofdigital-analog mixed circuit design, high power ICmanufacturing technologies, and high power packagingdesign/process, in order to guarantee their performanceand lifetime. In this paper, we overviewed our works onthe packaging/assembly development of high powerpackages, including three parts: (1) Thermal simulationand die bond defect control (2) Mechanical integritymodel for soft package heatsink implementation (3) Alwire multiphysics modeling and reliability of plasticpower package.