机译:电子封装用新型纳米复合材料热界面材料的机械和热学表征
Shanghai Univ, Key Lab Adv Display & Syst Applicat, Sch Automat & Mech Engn, SMIT Ctr, 20 Chengzhong Rd,2nd Floor,Chem Bldg, Shanghai 201800, Peoples R China|Chalmers, Dept Microtechnol & Nanosci, Elect Mat & Syst Lab, Kemivagen 9, SE-41296 Gothenburg, Sweden;
Shanghai Univ, Key Lab Adv Display & Syst Applicat, Sch Automat & Mech Engn, SMIT Ctr, 20 Chengzhong Rd,2nd Floor,Chem Bldg, Shanghai 201800, Peoples R China|Chalmers, Dept Microtechnol & Nanosci, Elect Mat & Syst Lab, Kemivagen 9, SE-41296 Gothenburg, Sweden;
Shanghai Univ, Key Lab Adv Display & Syst Applicat, Sch Automat & Mech Engn, SMIT Ctr, 20 Chengzhong Rd,2nd Floor,Chem Bldg, Shanghai 201800, Peoples R China|Chalmers, Dept Microtechnol & Nanosci, Elect Mat & Syst Lab, Kemivagen 9, SE-41296 Gothenburg, Sweden;
Chalmers, Dept Microtechnol & Nanosci, Elect Mat & Syst Lab, Kemivagen 9, SE-41296 Gothenburg, Sweden|SHT Smart High Tech AB, Aschebergsgatan 46, S-41133 Gothenburg, Sweden;
SHT Smart High Tech AB, Aschebergsgatan 46, S-41133 Gothenburg, Sweden;
Shanghai Univ, Key Lab Adv Display & Syst Applicat, Sch Automat & Mech Engn, SMIT Ctr, 20 Chengzhong Rd,2nd Floor,Chem Bldg, Shanghai 201800, Peoples R China|Chalmers, Dept Microtechnol & Nanosci, Elect Mat & Syst Lab, Kemivagen 9, SE-41296 Gothenburg, Sweden;
Nano-TIM; Nano-fiber; Microelectronic packaging;
机译:Zn薄膜作为热界面材料的LED的热和光学性能在电子封装应用中
机译:具有粗糙界面的热应力材料的机械测试:热障复合材料中的机械诱导分层开裂
机译:界面材料对电子封装热阻的影响
机译:预测倒装芯片电子封装中第一级热界面材料(TIM)的热机械降解
机译:电子封装热界面材料的微米/纳米级表征和建模。
机译:膨胀石墨/石蜡/硅橡胶作为用于热能存储和热界面材料的高温形状稳定相变材料
机译:用于芯片级封装功率器件的无孔无铅焊料热界面材料的热和热机械性能