Design, Materials, and Assembly Process of High-Density Packages with a Low-Temperature Lead-Free Solder (SnBiAg)

摘要

The High Density Packaging Users Group Consortium (HDPUG) has conducted a study of process development and solder joint reliability of high-density packages on printed circuit boards (PCB) using a low melting temperature lead-free solder (Sn-57wt%Bi-lwt%Ag). The design, materials, and assembly process aspects of the project are discussed in this study. The components studied include several SMT package types and various lead configurations. The assembly process addresses the low-temperature lead free assembly process, inspection and analysis of these boards and packages. A companion paper, "Reliability Tests and Failure Analyses of High-Density Packages with a Low-Temperature Lead-Free Solder (SnBiAg)" is also published in these Proceedings.