LEAD-FREE SOLDER MATERIAL AND ELECTRONIC COMPONENT PACKAGING STRUCTURE, AND METHOD FOR PRODUCING THE LEAD-FREE SOLDER MATERIAL

摘要

PROBLEM TO BE SOLVED: To provide a lead-free solder material which has a reduced load on environment, to provide an electronic component packaging structure using the same, and to provide a method for producing the lead-free solder material.;SOLUTION: The lead-free solder material is obtained by adding spherical ceramics into solder. The blending ratio of the ceramics is 10 to 50 vol.% to the whole quantity. The average particle diameter of the ceramics is 1 to 100 m.;COPYRIGHT: (C)2011,JPO&INPIT