SURFACE TREATMENT AGENT FOR TIN OR TIN ALLOY MATERIAL, TIN OR TIN ALLOY MATERIAL, SURFACE TREATMENT METHOD THEREFOR, TIN ALLOY BASED SOLDER MATERIAL, SOLDER PASTE OBTAINED BY USING THE SAME, METHOD OF PRODUCING TIN ALLOY BASED SOLDER MATERIAL, ELECTRONIC COMPONENT, PRINTED CIRCUIT BOARD AND MOUNTING STRUCTURE FOR ELECTRONIC COMPONENT

摘要

PPROBLEM TO BE SOLVED: To provide Sn or an Sn alloy which has improved corrosion resistance, oxidation resistance and deterioration resistance, to provide a surface treatment material for these metals and a production method therefor, to provide a lead-free solder material of an Sn-Zn base or the like having improved solderability, oxidation and deterioration resistance, realizing air reflowing and having a low melting point, to provide solder paste, and to provide a surface treatment method therefor. PSOLUTION: In the surface treatment method, Sn or an Sn alloy or Sn-Zn based solder grains 1 with which the surface of a metallic material such as iron, a steel sheet, copper or the like is coated (electroplating, hot dip plating or the like) is subjected to surface treatment with phosphoric acid ester and a silicon-containing compound to form a protective film 2. The solder paste consists of a solder material 6 in which a protective film 2 made of phosphoric acid ester and a silicon-containing compound is formed on the surfaces of the Sn-Zn based solder grains 1, and flux. PCOPYRIGHT: (C)2005,JPO&NCIPI