The Development of Reliable Contacting Methods with Solder for Electronic Circuits, Including Investigation of Surface Reactions during Soldering

摘要

Soldering, particularly in electronic circuit fabrication, was investigated. Soldering methodology and parameters are discussed. The soldering of thick film circuits in an oxygen free protective atmosphere and without flux is depicted. The improvement and stabilization of solderability of printed circuits and component leads are shown. Test results on the soldering qualities of thick film conductor pastes are presented. Concurrently, test methods were developed. A quantitative method which determines age damage to soldered connections is given along with a solderability test method and a nondestructive test for soldered connection strength on printed circuits. The extension of soldered connection lifetime by increasing the resistance of solders to thermal fatigue is also considered.