Method for producing solder contact on contact element at outer side of electrical or electronic component, involves applying solder in form of solder droplet on surface of printed circuit board using dispenser

摘要

The method involves applying solder on a surface (4) of a printed circuit board (1) corresponding to geometrical arrangement of a contact element (5). An electrical or electronic component (6) is attached to the board provided with solder such that the contact element of the electronic component and the solder of the board lie on top of each other. The solder is remelted by heating such that the solder is released from the board and applied on the contact element for forming a solder contact. The solder is applied in a form of a solder droplet (3) on a surface of the board using a dispenser.