首页> 外文会议>International Conference on Silicon Carbide and Related Materials 2001 Pt.2 Oct 28-Nov 2, 2001 Tsukuba, Japan >Gamma-Ray Irradiation Effects on the Electrical Characteristics of 6H-SiC MOSFETs with Annealed Gate-Oxide
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Gamma-Ray Irradiation Effects on the Electrical Characteristics of 6H-SiC MOSFETs with Annealed Gate-Oxide

机译:γ射线辐照对6G-SiC MOSFET退火后的电特性的影响

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摘要

The gamma-ray irradiation effects on channel mobility (μ) and threshold voltage (V_T) for n-channel 6H-SiC metal-oxide-semiconductor field effect transistors (MOSFETs) were studied. The gate oxide of the MOSFETs was fabricated using pyrogenic oxidation and subsequent annealing in steam at 800℃ or in H_2 at 700℃. The value of μ for the MOSFETs whose gate oxide was annealed in steam and in H_2 is not changed up to 180 and 60 kGy(SiO_2), respectively. By irradiation at 530 kGy(SiO_2), the change of V_T for the MOSFETs whose gate oxide was annealed in steam and in H_2 is 0.6 V (from 2.7 to 3.3 V) and 2.2 V (from 0.9 to 3.1V), respectively.
机译:研究了γ射线对n沟道6H-SiC金属氧化物半导体场效应晶体管(MOSFET)的沟道迁移率(μ)和阈值电压(V_T)的影响。 MOSFET的栅极氧化物是通过热解氧化和随后在800℃的蒸汽或700℃的H_2中退火制成的。栅极氧化物在蒸汽中和H_2中退火的MOSFET的μ值分别在180和60 kGy(SiO_2)不变。通过以530 kGy(SiO_2)照射,栅氧化层在蒸汽中和H_2中退火的MOSFET的V_T的变化分别为0.6 V(从2.7到3.3 V)和2.2 V(从0.9到3.1V)。

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