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Growth of (Zr,Ti)N Thin Films by Ion-Assisted Dual D.C. Reactive Magnetron Sputtering

机译:离子辅助双直流反应磁控溅射法生长(Zr,Ti)N薄膜

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摘要

The ternary nitride (Zr,Ti)N thin films were grown on silicon substrates by ion-assisted dual d.c. reactive magnetron sputtering technique. The substrates were exposed to ion bombardment with varying kinetic energy in the range of 3-103 eV under N/Ar ratio of 1:3. The (Zr_(0.6)Ti_(0.4))N was formed at all growth conditions. X-ray diffraction measurement indicates the presence of (Zr,Ti)N solid solution with (111) and (200) preferred orientations. The (200) orientation is only present when the films are grown at ion bombardment energies higher than 33 eV. Optimum conditions for film growth produced hardness in the range of 27-29 GPa.
机译:通过离子辅助双dc在硅衬底上生长三元氮化物(Zr,Ti)N薄膜。反应磁控溅射技术。在N / Ar比为1:3的情况下,将基板暴露在离子轰击下,其动能范围为3-103 eV。 (Zr_(0.6)Ti_(0.4))N在所有生长条件下均形成。 X射线衍射测量表明存在具有(111)和(200)优选取向的(Zr,Ti)N固溶体。只有在离子轰击能量高于33 eV的条件下生长薄膜时,才会出现(200)取向。膜生长的最佳条件可产生27-29 GPa的硬度。

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