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Growth of (Zr,Ti)N Thin Films by Ion-Assisted Dual D.C. Reactive Magnetron Sputtering

机译:通过离子辅助双D.C的(Zr,Ti)N薄膜的生长反应磁控溅射

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The ternary nitride (Zr,Ti)N thin films were grown on silicon substrates by ion-assisted dual d.c. reactive magnetron sputtering technique. The substrates were exposed to ion bombardment with varying kinetic energy in the range of 3-103 eV under N/Ar ratio of 1:3. The (Zr_(0.6)Ti_(0.4))N was formed at all growth conditions. X-ray diffraction measurement indicates the presence of (Zr,Ti)N solid solution with (111) and (200) preferred orientations. The (200) orientation is only present when the films are grown at ion bombardment energies higher than 33 eV. Optimum conditions for film growth produced hardness in the range of 27-29 GPa.
机译:通过离子辅助双D.C,在硅基板上生长三元氮化物(Zr,Ti)N薄膜。反应磁控溅射技术。在N / AR比为1:3的N / AR比下,将基材暴露于离子轰击,在3-103eV的范围内,在3-103eV的范围内。在所有生长条件下形成(Zr_(0.6)Ti_(0.4))n。 X射线衍射测量表明(Zr,Ti)N固溶体的存在(111)和(200)优选取向。 (200)取向仅在电影以高于33 eV的离子轰击能量时出现。薄膜生长的最佳条件在27-29GPa的范围内产生硬度。

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