首页> 外文会议>European Solid-State Device Research Conference;ESSDERC; 20070911-13;20070911-13; Muenchen(DE);Muenchen(DE) >Design and Characterization of STI Compatible High-Voltage NMOS and PMOS Devices in Standard CMOS Process
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Design and Characterization of STI Compatible High-Voltage NMOS and PMOS Devices in Standard CMOS Process

机译:标准CMOS工艺中与STI兼容的高压NMOS和PMOS器件的设计与表征

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摘要

This paper presents the design of High-Voltage NMOS and PMOS devices with STI (shallow trench isolation) technology fully compatible with a standard 0.25um/5V CMOS process technology. Breakdown voltages of 35V for n-channel with a specific on resistance of 1.96mΩ.cm~2 and -45V for p-channel with a specific on-resistance of 8.73mΩ.cm~2 have been achieved without any modification of existing standard CMOS process.
机译:本文介绍了采用STI(浅沟槽隔离)技术与标准0.25um / 5V CMOS工艺技术完全兼容的高压NMOS和PMOS器件的设计。在不对现有标准CMOS进行任何修改的情况下,n沟道的导通电阻为1.96mΩ.cm〜2的击穿电压为35V,p沟道的导通电阻为8.73mΩ.cm〜2的击穿电压为-45V处理。

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