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Actinic EUVL mask blank defect inspection by EUV photoelectron microscopy

机译:通过EUV光电子显微镜检查光化性EUVL掩模空白缺陷

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摘要

A new method for the actinic at-wavelength inspection of defects inside and ontop of Extreme Ultraviolet Lithography (EUVL) multilayer-coated mask blanks is presented. The experimental technique is based on PhotoElectron Emission Microscopy (PEEM) supported by the generation of a standing wave field inside and above the multilayer mask blank when illuminated near the resonance Bragg wavelength at around 13.5 nm wavelength. Experimental results on programmed defect samples based on e-beam lithographic structures or PSL equivalent silica balls overcoated with an EUV multilayer show that buried defects scaling down to 50 nm in lateral size are detectable with further scalability down to 30 nm and smaller due to the PEEM's instrumental performance. Furthermore, phase structures as shallow as 6 nm in height on a programmed phase grating sample has been detected by this technique. The visibility of the phase defect structures has been shown to be strongly dependent on and controlled by the phase of the standing wave field at the mask blank surface and thus can be optimized by tuning the illumination wavelength between 12.5 nm and 13.8 nm.
机译:提出了一种新的光化波长检查极端紫外光刻(EUVL)多层涂覆的掩模坯料内部和顶部缺陷的新方法。实验技术基于光电子发射显微镜(PEEM),当在13.5 nm波长的共振布拉格波长附近照射多层掩模毛坯时,在多层掩模毛坯内部和上方会产生驻波场。对基于电子束光刻结构或覆盖有EUV多层的PSL等效二氧化硅球的程序化缺陷样品进行的实验结果表明,可以检测到横向尺寸缩小到50 nm的掩埋缺陷,并且由于PEEM的原因可进一步扩展到30 nm或更小器乐演奏。此外,通过该技术已经检测到在编程的相位光栅样品上高度低至6 nm的相位结构。已经显示出相缺陷结构的可见性强烈依赖于掩模空白表面处的驻波场的相位并受其控制,因此可以通过在12.5 nm和13.8 nm之间调整照明波长来使其最佳化。

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