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3D packaging technology for vision CMOS VLSI: review and performance evaluation

机译：用于视觉CMOS VLSI的3D封装技术：审查和性能评估

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Abstract: Abstract not available.

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《Electronics and Structures for MEMS》|1999年|p.248-256|共9页
会议地点 Royal Pines Resort(AU)
作者
Amine Bermak; Edith Cowan Univ.; Joondalup WA; Australia; Abdesselam Bouzerdoum; Edith Cowan Univ.; Joonkalup WA; Australia; Kamran Eshraghian; Edith Cowan Univ.; Joondalup WA; Australia.;
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正文语种 eng
中图分类微电子学、集成电路（IC）;
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4. 3D packaging technology for vision CMOS VLSI: review and performance evaluation [C] . Amine Bermak, Abdesselam Bouzerdoum, Kamran Eshraghian Conference on electronics and structures for MEMS . 1999

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3D packaging technology for vision CMOS VLSI: review and performance evaluation

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