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Rapid recipe formulation for plasma etching of new materials

机译:快速配方配方,用于新材料的等离子蚀刻

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摘要

A fast and inexpensive scheme for etch rate prediction using flexible continuum models and Bayesian statistics is demonstrated. Bulk etch rates of MgO are predicted using a steady-state model with volume-averaged plasma parameters and classical Langmuir surface kinetics. Plasma particle and surface kinetics are modeled within a global plasma framework using Bayesian analysis and limited data. The accuracy of these predictions is evaluated with synthetic and experimental etch rate data for magnesium oxide in an ICP-RIE system. This approach is compared and superior to factorial models generated from JMP, a software package frequently employed for recipe creation and optimization.
机译:演示了使用灵活的连续谱模型和贝叶斯统计量的蚀刻速率预测的快速且便宜的方案。使用具有体积平均等离子体参数和经典Langmuir表面动力学的稳态模型,可以预测MgO的整体蚀刻速率。使用贝叶斯分析和有限的数据,在全局等离子框架内对等离子粒子和表面动力学建模。利用ICP-RIE系统中氧化镁的合成和实验蚀刻速率数据评估了这些预测的准确性。对这种方法进行了比较,并优于从JMP生成的阶乘模型,JMP是经常用于配方创建和优化的软件包。

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