首页> 外国专利> PLASMA ETCHING METHOD, PLASMA ETCHING APPARATUS, COMPUTER STORAGE MEDIUM, AND STORAGE MEDIUM WITH TREATMENT RECIPE STORED THEREON

PLASMA ETCHING METHOD, PLASMA ETCHING APPARATUS, COMPUTER STORAGE MEDIUM, AND STORAGE MEDIUM WITH TREATMENT RECIPE STORED THEREON

机译:等离子刻蚀方法,等离子刻蚀装置,计算机存储介质以及存储了治疗方法的存储介质

摘要

PPROBLEM TO BE SOLVED: To provide a plasma etching method, plasma etching apparatus, computer storage medium, and storage medium with a treatment recipe stored thereon, in which the occurrence of roughness in the background film of a high fusing point metal film can be suppressed in comparison with the prior art. PSOLUTION: A method of performing plasma etching, through a mask layer 103, on a high fusing point metal film 102 of a substrate 10 to be treated, includes: a first etching step of performing plasma etching during which an etching speed of a grain boundary is higher than an etching speed of grains, and a second etching step of performing plasma etching during which the selection ratio of the high fusing point metal film in an insulating film is higher than that of the first etching step. Prior to exposing an insulating film 101 in the grain boundary, switching is performed from the first etching step to the second etching step. PCOPYRIGHT: (C)2008,JPO&INPIT
机译:

要解决的问题:提供一种等离子体蚀刻方法,等离子体蚀刻装置,计算机存储介质和在其上存储有处理配方的存储介质,其中在高熔点金属膜的背景膜中出现粗糙度与现有技术相比可以抑制。解决方案:一种通过掩模层103在要处理的基板10的高熔点金属膜102上进行等离子体蚀刻的方法,包括:第一蚀刻步骤,该第一蚀刻步骤执行等离子体蚀刻,其蚀刻速度为晶界高于晶粒的蚀刻速度,并且进行等离子体蚀刻的第二蚀刻步骤,其间绝缘膜中的高熔点金属膜的选择比高于第一蚀刻步骤的选择比。在将绝缘膜101暴露在晶界中之前,执行从第一蚀刻步骤到第二蚀刻步骤的切换。

版权:(C)2008,日本特许厅&INPIT

著录项

  • 公开/公告号JP2007266466A

    专利类型

  • 公开/公告日2007-10-11

    原文格式PDF

  • 申请/专利权人 TOKYO ELECTRON LTD;

    申请/专利号JP20060091721

  • 发明设计人 FUJINAGA MOTOTAKE;

    申请日2006-03-29

  • 分类号H01L21/3065;C23F4;H01L21/28;H01L21/336;H01L29/786;

  • 国家 JP

  • 入库时间 2022-08-21 21:16:17

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