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Conference on Design-Process-Technology Co-optimization for Manufacturability X

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1.A Comparative Study on the Yield Performance of Via Landing and Direct Stitching Processes for 2-D Pattern Connection

机译：通过降落和直接缝合工艺对2-D模式连接的产量性能的比较研究
- 作者：Jun Zhou;Yijian Chen
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability X》 | 2016年
- via landing;
- direct stitching;
- edge-placement errors (EPE);
- probability of success (POS);
2.LELE CD Bias Offset Monitor through OVL Measurement

机译：LELE CD偏置通过OVL测量偏移监视器
- 作者：Chia Ching Lin;En Chuan Lio;Chang Mao Wang;Howard Chen;Sho Shen Lee;Henry Hsing;Kince Liu;Nuriel Amir
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability X》 | 2016年
- Double patterning;
- LELE;
- etching CD bias;
- Triple AIM;
- Mark segmentation;
3.Triple/Quadruple Patterning Layout Decomposition via Novel Linear Programming and Iterative Rounding

机译：通过新颖的线性规划和迭代舍入的三倍/四倍图案化布局分解
- 作者：Yibo Lin;Xiaoqing Xu;Bei Yu;Ross Baldick;David Z. Pan
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability X》 | 2016年
4.An Integrated Design-to-Manufacturing Flow for SADP

机译：用于SADP的集成设计流程
- 作者：Ahmed Hamed Fatehy;Rehab Kotb;James Word
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability X》 | 2016年
- SADP;
- SADP-Line-End-Cuts;
- SADP-OPC;
- SADP-Verification;
- SADP-DFM;
- Manufacturing-Flow;
- Multi-Patterning;
- SADP-DTCO;
- SADP-LPE;
5.Enablement of DSA for VIA layer in a SIT process flow

机译：在静坐过程流中启用DSA的VIA层
- 作者：L. Schneider;V. Farys;E. Serret;C. Fenouillet-Beranger
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability X》 | 2016年
- DSA;
- SIT;
- Co-optimization;
- Design rules;
- Percolation;
6.Structural Design, Layout Analysis and Routing Strategy for Constructing IC Standard Cells Using Emerging 3D Vertical MOSFETs

机译：使用新出现的3D垂直MOSFET构建IC标准单元的结构设计，布局分析和路由策略
- 作者：Hongyi Liu;Chuyang Hong;Ting Han;Jun Zhou;Yijian Chen
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability X》 | 2016年
7.Verification and application of multi-source focus quantification

机译：多源焦点量化的验证和应用
- 作者：J-G. Simiz;T. Hasan;F. Staals;B. Le-Gratiet;W.T. Tel;C.Prentice;J-W. Gemmink;A. Tishchenko;Y. Jourlin
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability X》 | 2016年
- Depth of focus;
- intrafield;
- scanner leveling;
- topography;
- scanner;
- product design layout effect;
- PLS regression analysis;
8.Expanding the Printable Design Space for Lithography Processes Utilizing a Cut Mask

机译：利用剪切面罩扩展可打印设计空间的光刻工艺
- 作者：Jerome Wandell;Mohamed Salama;William Wilkinson;Mark Curtice;Jui-Hsuan Feng;Shao Wen Gao;Abhishek Asthana
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability X》 | 2016年
9.Toward The 5nm Technology: Layout Optimization and Performance Benchmark for Logic/SRAMs Using Lateral and Vertical GAA FETs

机译：朝向5NM技术：使用横向和垂直GAA FET的逻辑/ SRAM的布局优化和性能基准
- 作者：Trong Huynh-Bao;Julien Ryckaert;Sushil Sakhare;Abdelkarim Mercha;Diederik Verkest;Aaron Thean;Piet Wambacq
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability X》 | 2016年
- 5nm technology;
- 6T-SRAMs;
- CMOS scaling;
- disruptive transistor;
- DTCO;
- EUVL;
- lateral GAA FETs;
- nanowire;
- standard-cells;
- vertical GAA FETs;
10.Methodology to Extract, Data Mine and Score Geometric Constructs from Physical Design Layouts for Analysis and Applications in Semiconductor Manufacturing

机译：从半导体制造中的物理设计布局中提取，数据矿和分数几何构建体的方法学
- 作者：Piyush Pathak;Karthik Krishnamoorthy;Wei-Long Wang;Ya-Chieh Lai;Frank E. Gennari;Shikha Somani;Bob Pack;Uwe Paul Schroeder;Fadi Batarseh;Jaime Bravo;Jason Sweis;Philippe Hurat;Sriram Madhavan
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability X》 | 2016年
11.Design Technology Co-optimization for 14/10nm Metal1 Double Patterning Layer

机译：设计技术合作14/10NM金属1双图案化层
- 作者：Yingli Duan;Xiaojing Su;Ying Chen;Yajuan Su;Feng Shao;Recco Zhang;Junjiang Lei;Yayi Wei
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability X》 | 2016年
- DTCO;
- double patterning;
- Design rule optimization;
- IC manufacture;
- Lithography technology;
12.Methodology for analyzing and quantifying design style changes and complexity using topological patterns

机译：使用拓扑模式分析和量化设计风格的方法和复杂性的方法
- 作者：Jason P. Cain;Ya-Chieh Lai;Frank Gennari;Jason Sweis
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability X》 | 2016年
13.Design Strategy for Integrating DSA Via Patterning in sub-7 nm Interconnects

机译：DSA通过图案化在Sub-7 NM互连中集成DSA的设计策略
- 作者：Ioannis Karageorgos;Julien Ryckaert;Maryann C. Tung;H.-S. Philip Wong;Roel Gronheid;Joost Bekaert;Evangelos Karageorgos;Kris Croes;Geert Vandenberghe;Michele Stucchi;Wim Dehaene
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability X》 | 2016年
- directed self-assembly;
- templated DSA;
- via patterning;
- DSA letters;
- design;
- cost function;
- alphabet;
14.Optimization of Self-Aligned Double Patterning (SADP)-compliant layout designs using pattern matching for 10nm technology nodes and beyond

机译：使用模式匹配对10nm技术节点及更远的自对准双图案化（SADP）的替代布局设计的优化
- 作者：Lynn T.-N. Wang;Uwe Paul Schroeder;Youngtag Woo;Jia Zeng;Sriram Madhavan;Luigi Capodieci
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability X》 | 2016年
- DFM;
- SADP;
- line-cut decomposition;
- cut masks;
- line ends;
- pattern matching;
- layout optimization;
- lithography hotspots;
15.Using Pattern Enumeration to Accelerate Process Development and Ramp Yield

机译：使用模式枚举加速过程开发和斜坡收益率
- 作者：Linda Zhuang;Jenny Pang;Jessy Xu;Mengfeng Tsai;Amy Wang;Yifan Zhang;Jason Sweis;Ya-Chieh Lai;Hua Ding
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability X》 | 2016年
- Design Rule;
- Pattern Enumeration;
- Process Weak Point;
- Test Keys;
- Yield;
16.Electron beam lithography with character projection exposure for throughput enhancement with line-edge quality optimization

机译：电子束光刻，具有字符投影曝光，用于吞吐量增强，具有线边缘质量优化
- 作者：Rimon Ikeno;Satoshi Maruyama;Yoshio Mita;Makoto Ikeda;Kunihiro Asada
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability X》 | 2016年
- electron beam lithography;
- direct writing;
- character projection;
- variable shaped beam;
- MEMS;
- integrated optics;
- line edge roughness;
- Hydrogen Silsesquioxane;
17.Variability-Aware Compact Modeling and Statistical Circuit Validation on SRAM Test Array

机译：可变性感知的紧凑型模型和SRAM测试阵列的统计电路验证
- 作者：Ying Qiao;Costas J. Spanos
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability X》 | 2016年
- compact model characterization;
- statistical circuit simulation;
- SRAM test array;
18.Layout Decomposition and Synthesis for a Modular Technology to Solve the Edge-Placement Challenges by Combining Selective Etching, Direct Stitching, and Alternating-Material Self-Aligned Multiple Patterning Processes

机译：通过组合选择性蚀刻，直接缝合和交替材料自对准多图案化工艺来解决模块化技术的布局分解和合成来解决边缘置于挑战挑战
- 作者：Hongyi Liu;Ting Han;Jun Zhou;Yijian Chen
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability X》 | 2016年
19.Automatic Layout Feature Extraction for Lithography Hotspot Detection Based on Deep Neural Network

机译：基于深神经网络的光刻热点检测自动布局特征提取
- 作者：Tetsuaki Matsunawa;Shigeki Nojima;Toshiya Kotani
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability X》 | 2016年
- Lithography;
- Hotspot Detection;
- Feature Extraction;
- Machine Learning;
- Deep Neural Network;
20.Impacts of Process Variability of Alternating-Material Self-Aligned Multiple Patterning on SRAM Circuit Performance

机译：交替材料的过程变异性对SRAM电路性能的自对准多标图案的影响
- 作者：Ting Han;Chuyang Hong;Qi Cheng;Yijian Chen
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability X》 | 2016年
21.Hybrid hotspot detection using regression model and lithography simulation

机译：使用回归模型和光刻模拟的混合热点检测
- 作者：Taiki Kimura;Tetsuaki Matsunawa;Shigeki Nojima;David Z. Pan
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability X》 | 2016年
- hotspot;
- regression;
- optical intensity;
- lithography simulation;
- SVM;
- SVR;
22.Hotspot Detection and Removal Flow Using Multi-Level Silicon-Calibrated CMP Models

机译：使用多级硅校准CMP型号的热点检测和移除流动
- 作者：Ushasree Katakamsetty;Jansen Chee;Yongfu Li;Colin Hui;Jaime Bravo;Tamba Gbondo-Tugbawa;Brian Lee;Kuang-Han Chen;Aaron Gower-Hall;Sang-Min Han
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability X》 | 2016年
- Chemical Mechanical Polishing (CMP);
- Topography Variation;
- Height Variation;
- Hotspots;
- Pooling;
- Depth of Focus (DOF);
- Hotspot Clustering;
23.Impact of EUV patterning scenario on different design styles and their ground rules for 7nm/5nm node BEOL layers

机译：EUV Patterning场景对7nm / 5nm节点BEOL层不同设计风格及其地面规则的影响
- 作者：Tsann-Bim Chiou;Alek C. Chen;Mircea Dusa;Shih-En Tseng
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability X》 | 2016年
- EUV;
- BEOL;
- design style;
- metal;
- cut block;
- edge placement error;
- line edge roughness;
- elongated via;
24.Migrating from Older to Newer Technology Nodes and Discovering the Process Weak-Points

机译：从较旧的技术节点迁移并发现过程弱点
- 作者：Linda Zhuang;Jenny Pang;Jessy Xu;Mengfeng Tsai;Xue Long Shi;Qing Wei Liu;Ellyn Yang;Yifan Zhang;Jason Sweis;Ya-Chieh Lai;Hua Ding
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability X》 | 2016年
- DRM;
- Pattern Enumeration;
- Process Weak-point;
- Test Pattern;
- Yield;
25.Using pattern analysis methodology to do fast detection of manufacturing pattern failure.

机译：使用模式分析方法进行快速检测制造图案故障。
- 作者：Evan Zhao;Jessie Wang;Mason Sun;Jeff Wang;Yifan Zhang;Jason Sweis;Ya-Chieh Lai;Hua Ding
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability X》 | 2016年
- Pattern;
- DFT;
- systematic design failure;
- electrical failure analysis;
- yield;
26.Integrated Layout Based Monte-Carlo Simulation for Design Arc Optimization

机译：基于集成布局的设计弧优化Monte-Carlo仿真
- 作者：Dongbing Shao;Larry Clevenger;Lei Zhuang;Lars Liebmann;Robert Wong;James Culp
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability X》 | 2016年
27.WAFER HOTSPOT PREVENTION USING ETCH AWARE OPC CORRECTION

机译：使用蚀刻感知OPC校正晶圆热点预防
- 作者：Ayman Hamouda;Dave Power;Mohamed Salama;Chen AO
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability X》 | 2016年
- Etch Model;
- Etch Correction;
- Optical Proximity Correction (OPC);
- OPC Repair Flow;
- Design Enablement;
- Lithography;
- Optical Rule Check (ORC);
28.Modeling Interconnect Corners under Double Patterning Misalignment

机译：双图案化未对准下的互连角落
- 作者：Daijoon Hyun;Youngsoo Shin
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability X》 | 2016年
29.Pattern-based DTCO flow for early estimation of lithographic difficulty using optical image processing

机译：基于模式的DTCO流程，用于使用光学图像处理的光刻难度估计
- 作者：Moutaz Fakhry;Kareem Madkour;Wael ElManhawy;Jason Cain;Joe Kwan
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability X》 | 2016年
30.Design space exploration for early identification of yield limiting patterns

机译：屈服限制模式早期识别设计空间探索
- 作者：Helen Li;Elain Zou;Robben Lee;Sid Hong;Square Liu;JinYan Wang;Chunshan Du;Recco Zhang;Kareem Madkour;Hussein Ali;Danny Hsu;Aliaa Kabeel;Wael ElManhawy;Joe Kwan
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability X》 | 2016年
31.Building block style recipes for productivity improvement in OPC, RET and ILT flows

机译：构建块样式配方，用于OPC，RET和ILL流程的生产力改进
- 作者：Linghui Wu;Denny Kwa;Jinyin Wan;Tom Wang;Matt St. John;Steven Deeth;Xiaohui Chen;Tom Cecil;Xiaodong Meng;Kevin Lucas
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability X》 | 2016年
32.Metal stack optimization for low power and high density for N7-N5

机译：金属堆栈优化用于低功耗和N7-N5的高密度
- 作者：P. Raghavan;F. Firouzi;L. Matti;P. Debacker;R. Baert;S. M. Y. Sherazi;D. Trivkovic;V. Gerousis;M. Dusa;J. Ryckaert;Z. Tokei;D. Verkest;G. McIntyre;K. Ronse
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability X》 | 2016年
33.Integrated Routing and Fill for Self-Aligned Double Patterning (SADP) Using Grid-Based Design

机译：使用基于网格的设计集成路由和填充自对准双图案化（SADP）
- 作者：Youngsoo Song;Jeemyung Lee;Seongmin Lee;Youngsoo Shin
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability X》 | 2016年
34.Estimate Design sensitivity to process variation for the 14nm node

机译：估算设计敏感性对14nm节点的处理变化
- 作者：Guillaume Landie;Vincent Farys
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability X》 | 2016年
- Overlay;
- Process Window variation;
- Design Rules Optimization;
35.Hybrid Pattern Matching Based SRAF Placement

机译：基于混合模式匹配的SRAF放置
- 作者：Ahmed Omran;Andrey Lutich;Uwe Paul Schroeder
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability X》 | 2016年
- SRAF;
- Pattern Matching;
- DFM;
- ILT;
- Assist Feature;
- OPC;
- 28nm;
- SRAF-POP;
36.Interlayer Design Verification methodology using contour image

机译：使用轮廓图像的层间设计验证方法
- 作者：Minyoung-Shim;Seoksan-Kim;Sungmin-Park;Seiryung-Choi;Namjung-Kang;Hyunju-Sung;Jinwoo-Choi;Jaepil-Shin;Jaekyun-Park;Myungseob-Shim;Hyeongsun-Hong;Kyupil-Lee
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability X》 | 2016年
- Interlayer Design Verification;
- Contour;
- non-destructive inspection;
- statistical analysis;
- massive data;
37.A Random Approach of Test Macro Generation for Early Detection of Hotspots

机译：热点早期检测试验宏生成的随机方法
- 作者：Jong-hyun Lee;Chin Kim;Minsoo Kang;Sungwook Hwang;Jae-seok Yang;Mohammed Harb;Mohamed Al-Imam;Kareem Madkour;Wael ElManhawy;Joe Kwan
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability X》 | 2016年
- Multiple Patterning;
- Test Macro Generation;
- Litho Hotspot Detection;
- Test Vehicle;
38.Rapid recipe formulation for plasma etching of new materials

机译：用于血浆蚀刻新材料的快速配方配方
- 作者：Meghali Chopra;Zizhuo Zhang;John Ekerdt;Roger T. Bonnecaze
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability X》 | 2016年
- experimental design;
- etching;
- recipe creation and optimization;
- Bayesian;
39.Advanced DFM application for automated bit-line pattern dummy

机译：用于自动位线模式虚拟的高级DFM应用程序
- 作者：Tae Hyun Shin;Cheolkyun Kim;Hyunjo Yang;Mohamed Bahr
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability X》 | 2016年
- DFM;
- bit-line;
- pattern dummy;
- physical verification;
40.The new analysis method of PWQ in the DRAM Pattern

机译：DRAM模式中PWQ的新分析方法
- 作者：Daehan Han;Jinman Chang;Taeheon Kim;Kyusun Lee;Yonghyeon Kim;Jinyoung Kang;Aeran Hong;Bumjin Choi;Joosung Lee;Hyoung Jun Kim;Kweonjae Lee;Hyoungsun Kim;Gyoyoung Jin
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability X》 | 2016年
- Process Window Qualification (PWQ);
- die to data base matching;
- quantitative analysis;
41.Directed Self-Assembly Aware Restricted Design Rule and its Impact on Design-ability

机译：定向自组装意识到受限制的设计规则及其对设计能力的影响
- 作者：Yulu Chen;Ryoung-han Kim
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability X》 | 2016年
- Directed Self-Assembly (DSA);
- Grapho-Epitaxy;
- Restricted Design Rules (RDR);
- Design Rule Check (DRC);
- Full Chip;
42.Characterization of Shallow Trench Isolation CMP Process and Its Application

机译：浅沟渠隔离CMP工艺的表征及其应用
- 作者：Helen Li;ChunLei Zhang;JinBing Liu;ZhengFang Liu;Kuang Han Chen;Tamba Gbondo-Tugbawa;Hua Ding;Flora Li;Brian Lee;Aaron Gower-Hall;Yang-Chih Chiu
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability X》 | 2016年
43.Model-Based CMP Aware RC Extraction of Interconnects in 16nm Designs

机译：基于模型的CMP感知RC提取16nm设计中的互连
- 作者：Yongchan Ban;Sang Min Han;Eunjoo Choi;Tamba Gbondo-Tugbawa;Kuang Han Chen
- 会议名称：《Conference on Design-Process-Technology Co-optimization for Manufacturability X》 | 2016年
- CMP;
- Process Variation;
- Design-for-Manufacturability;
- Model-based;
- RC Extraction;
- Interconnects;
- Timing;