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LL-PCM: Low-Latency Phase Change Memory Architecture

机译:LL-PCM:低延迟相变存储器架构

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PCM is a promising non-volatile memory technology, as it can offer a unique trade-off-between density and latency compared with DRAM and flash memory. Albeit PCM is much faster than flash memory, it is still notably slower than DRAM, which can significantly degrade system performance. In this paper, we analyze a PCM implementation in depth, and identify the primary cause of PCM’s long latency, i.e., a long interconnect (high resistance/capacitance) path between a cell and a sense-amp/write-driver. This in turn requires (1) a very large charge pump consuming: ~20% of PCM chip space, ~50% of latency of write operations, and ~2× more power than a write operation itself; and (2) a large current sense-amp with long time to pre-charge the interconnect path. Then, we propose Low-Latency PCM (LL-PCM) architecture. Our analysis shows that LL-PCM can give 119% higher performance and consume 43% lower memory energy than PCM for memory-intensive applications. LL-PCM is only ~1% larger than PCM, as the cost of reducing the resistance/capacitance of the interconnect path is negated by its 4.1× smaller charge pump. CCS CONCEPTS • B.3.1 Semiconductor Memories
机译:PCM是一种很有前途的非易失性存储技术,因为与DRAM和闪存相比,它可以在密度和等待时间之间提供独特的折衷方案。尽管PCM比闪存快得多,但仍然比DRAM慢得多,这会大大降低系统性能。在本文中,我们深入分析了PCM的实现,并确定了PCM延迟时间长的主要原因,即单元与感测放大器/写驱动器之间的互连时间长(高电阻/电容)。反过来,这又需要(1)非常大的电荷泵消耗:约20%的PCM芯片空间,约50%的写操作延迟以及比写操作本身多2倍的功耗; (2)大电流检测放大器,需要很长时间才能对互连路径进行预充电。然后,我们提出了低延迟PCM(LL-PCM)体系结构。我们的分析表明,对于内存密集型应用程序,与PCM相比,LL-PCM可以提供119%的更高性能,并消耗43%的内存能量。 LL-PCM仅比PCM大约1%,因为降低互连路径的电阻/电容的成本被其4.1倍小的电荷泵所抵消。 CCS概念•B.3.1半导体存储器

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