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MEMS module integration into SiGe BiCMOS technology for embedded system applications

机译:MEMS模块集成到SiGe BiCMOS技术中,用于嵌入式系统应用

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The introduction of radio frequency micro-electro-mechanical systems (RFMEMS) as a monolithic option into state-of-the-art Si/SiGe BiCMOS foundry processes has paved the way for single chip radio frequency microsystems at millimeter wave frequencies. Deep silicon substrate etch techniques have also been developed to prevent high substrate losses which help in achieving high performance passive components at mm-wave frequencies. Using the same process techniques, realization of highly efficient on-chip antennas has become feasible, which in the millimeter-wave range no longer come with a hefty chip real estate penalty. In this paper, the current status of embedded BiCMOS+MEMS technology development is presented. Reconfigurable circuits using embedded RFMEMS switches and mm-wave transceivers with on-chip antennas are also discussed as application examples.
机译:射频微机电系统(RFMEMS)作为单片选项引入了最新的Si / SiGe BiCMOS铸造工艺中,为毫米波频率的单芯片射频微系统铺平了道路。还已经开发出深硅衬底蚀刻技术来防止高衬底损耗,这有助于实现毫米波频率下的高性能无源元件。使用相同的处理技术,实现高效的片上天线已变得可行,这在毫米波范围内不再带来沉重的芯片占用空间。本文介绍了嵌入式BiCMOS + MEMS技术的发展现状。作为应用示例,还将讨论使用嵌入式RFMEMS开关和带有片上天线的毫米波收发器的可重构电路。

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