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Agile MEMS packaging for mass customized MEMS products

机译:用于大规模定制MEMS产品的敏捷MEMS封装

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摘要

The market for micro electromechanical systems (MEMS) is becoming increasingly competitive especially for small and medium sized enterprises. The progressing trend in mass manufacturing leads to very few competitors that dominate the MEMS market. This competitive environment results in cheap devices with limited variation, therefore opportunities at the tail end of the market are usually neglected. The MEMS research community predominantly focuses on new device types and manufacturing methods with a high impact factor and those are naturally settled in the mass market segments. This paper introduces an approach for research and development that aims to open the opportunities within the long tail of the market. It consists mostly of a combination of new design approaches for MEMS and packaging, software tools and digital manufacturing technologies to ensure that solutions developed are ones that can be adapted to different customer requirement on a level that is perhaps uncommon in the MEMS community.
机译:微机电系统(MEMS)的市场竞争日趋激烈,特别是对于中小型企业。大规模制造的发展趋势导致在MEMS市场上独占competitors头的竞争对手很少。这种竞争环境导致廉价设备的变化有限,因此通常忽略了市场尾端的机会。 MEMS研究界主要关注具有高影响因子的新设备类型和制造方法,这些自然而然地融入了大众市场领域。本文介绍了一种研究和开发方法,旨在在市场的长尾中打开机会。它主要由用于MEMS和封装的新设计方法,软件工具和数字制造技术的组合组成,以确保开发的解决方案可以在MEMS社区中不常见的水平上适应不同的客户需求。

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