首页> 外文会议>17th European Conference on Mask Technology for Integrated Circuits and Microcomponents, 17th, Nov 13-14, 2000, Munich, Germany >Phase Defect Inspection of 130 nm Node Phase Shift Masks Using a Simultaneous Transmitted and Reflected Light Pattern Inspection Algorithm
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Phase Defect Inspection of 130 nm Node Phase Shift Masks Using a Simultaneous Transmitted and Reflected Light Pattern Inspection Algorithm

机译:使用同时透射和反射光图案检查算法的130 nm节点相移掩模的相缺陷检查

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摘要

Phase shifting mask technology will be necessary to produce integrated circuits at the 130 nm node using KrF wavelength steppers. In order to successfully accomplish this goal, it is necessary to detect and repair phase shifting defects that may occur in the manufacture of these reticles. An inspection algorithm has been developed to improve the phase shift defect detection rate of an UV reticle inspection system and is based upon the simultaneous use of the transmitted and reflected light signals. This paper describes the phase defect sensitivity improvement over transmitted light only pattern inspection results and simultaneous transmitted and reflected light based contamination inspection results.
机译:为了使用KrF波长步进器在130 nm节点处生产集成电路,将需要相移掩模技术。为了成功实现该目标,有必要检测和修复在制造这些标线时可能会发生的相移缺陷。已经开发了一种检查算法来提高UV掩模版检查系统的相移缺陷检测率,该检查算法基于同时使用透射和反射的光信号。本文介绍了相对于仅透射光模式检查结果以及同时基于透射光和反射光的污染检查结果而言,相缺陷灵敏度的提高。

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