SUBSTRATE COOLING UNIT, SUBSTRATE TREATMENT DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND PROGRAM

摘要

Provided is a technology comprising: a substrate retention mechanism that retains a substrate horizontally; a drive unit that raises and lowers the substrate retention mechanism; a cooling plate that has a facing surface that faces a surface of the substrate; a laser emission unit that is disposed at one lateral end of a space in which the substrate rises and descends and that emits laser beams that are distributed so as to be wide in the direction in which the substrate retention mechanism is raised and lowered and are parallel to the surface of the substrate; a laser beam receiving unit, disposed at the other lateral end of the space, that acquires light receiving position identification information indicating positions at which the laser beams emitted from the laser emission unit are received in the direction in which the substrate retention mechanism is raised and lowered; and a calculation unit that, on the basis of the light receiving position identification information acquired by the laser beam receiving unit, calculates the distance between the cooling plate and the substrate.