Encapsulating ceramic holder for cct. chips - has lower plate supporting chip and upper plate covering connecting paths to chips wires

摘要

The encapsulating ceramic holder for integrated circuit chips consists of two ceramic plates. The lower plate has a recesses central region to contain the chip (40'), and the upper plate (200) has a stepped-down, rectangular hole over the lower plate recess. The hole is larger than the recess and is stepped to accept a cover plate (210) that completely seals-in the chip. The chip contact wires (206) pass from pads on the chip to pads (207) around the edge of the recess. These pads are connected to conducting paths (254) meandering across the top surface of the lower plate and connecting with contact pins (286) extending right through both plates and forming a regular array. The conducting path are thus sandwiched between the two plates.