Method for Connecting to Semiconductor Chips without the Use of Wires

摘要

The method of this invention uses a machinable glass ceramic substrate into which an opening is provided for accommodating a semiconductor chip that is mounted flush with the top surface of the substrate to permit the screen printing of an electrically conductive pattern directly to the semiconductor chip and substrate surfaces. This method of construction eliminates the use of wires on hybrid microelectronic circuits for making the final electrical connection from conductor pattern on substrate surface to the semiconductor chip surface. (Author)