A semiconductor device that connects the bonding pads of the chip and the leads of the lead frame without using a connecting wire

摘要

Most of the sample pads of the semiconductor chip and most of the leader of the excitation frame are electrically connected semiconductor devices. The leader part of the excitation frame is formed by bending the tail of the inner circuit. The bent leader part is formed on the side of the chip and the chip (4) contains a metal adhesive (7) Use the semiconductor package installed after.