LIGHT EMITTING DEVICE CAPABLE OF CONNECTING ELECTRICALLY THE LEAD PART OF A SUBSTRATE AND AN LED CHIP WITHOUT WIRE BONDING, A LIGHT EMITTING DEVICE PACKAGE AND A MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A light emitting device, a light emitting device package and a manufacturing method thereof are provided to improve the productivity of a light emitting device package by omitting a die bonding process and a wire bonding process.;CONSTITUTION: A first semiconductor layer(132) is formed on a supporting member. An active layer(134) is formed on the first semiconductor layer. A second semiconductor layer(136) is formed on the active layer. A first electrode(140) is electrically connected to the first semiconductor layer. A second electrode(160) is electrically connected to the second semiconductor layer. A first lead part(158) is extended from the first electrode and passes through the supporting member.;COPYRIGHT KIPO 2013