Semiconductor device includes semiconductor chip that includes upper and lower contact plates which are integrally connected to upper chip metallization and lower chip metallization by upper and lower connecting layers

摘要

The semiconductor device has a semiconductor chip (1) that includes a semiconductor main structure (10) having an upper surface (10t) and lower surface (10b). The upper chip metallization (11) and lower chip metallization (12) are applied to the upper surface and lower surface respectively. A metallic upper contact plate (21) is integrally connected to the upper chip metallization by upper connecting layer (31). A lower contact plate (22) is integrally connected to the lower chip metallization by lower connecting layer (32). Independent claims are included for the following: (1) a pressing contact arrangement of semiconductor chip; and (2) a method for manufacturing semiconductor device.