Multichip on Aluminum Metal Plate Technology for High Power LED Packaging

摘要

Multichip on Aluminum Metal Plate(MOAMP)technology with simple structure and low thermal resistance is developed for effective heat removal of Light Emitting Diode(LED)p-n junction and LED lighting module to have high reliability.The thermal resistance of LED modules was numerical and experimental.Thermal resistance from the junction to aluminum metal plate,considering input power of LED module using MOAMP technology,is 3.02 K/W,3.23 K/W for the measured and calculated,respectively.We expect that the reported MOAMP technology with low thermal resistance will be a promising solution for high power LED lighting modules.