The Study of High Power LED Integrated Package Based on Thermoelectric Cooling

摘要

In this paper, a new type of semiconductor cooling technology is used for cooling of high power LED. There are two different package methods：integrated package and frame package. Experimental Batas show some results. With the integrated package, thermoelectric cooling devices can work with the current between l.SA-4.SA. When the current is 4.4A, chip junction temperature can be reduced to a minimum 19.80C，and chip brightness increased by 3.2%. With the frame package, thermoelectric cooling device operating current between the 2A-4.4A. When the current is 4.5A, chip junction temperature can be reduced to 29.10C，and chip brightness increased by 1.9%. Integrated package is superior to frame package.