首页> 外国专利> WAFER CHUCK FOR SILICON WET ETCHING TO FABRICATE X-RAY MASK

WAFER CHUCK FOR SILICON WET ETCHING TO FABRICATE X-RAY MASK

机译:硅晶片蚀刻晶圆夹头,可制造X射线面膜

摘要

The present invention relates to a wafer chuck for silicon wet etching for fabricating an X-ray mask.;More specifically, the present invention can prevent the outer periphery of the wafer from contacting the etchant during wet etching of the silicon during the X-ray mask fabrication process, or prevent the device mounted on one side of the wafer from contacting the etchant. A wafer chuck for silicon wet etching.;The silicon wet etching wafer chuck of the present invention is a silicon wet etching wafer chuck for X-ray mask fabrication, having an annular shape bent in an L shape at a cross section and having an O-ring (11) in the center of the bent flat surface. A lower support portion 10 for laying the outer peripheral portion of one surface of the wafer 50; And, when having an annular shape O-ring (21) is placed in the center and is installed on the bent surface of the lower support 10, the upper support 20 for fixing the outer peripheral portion of the other surface of the wafer 50 It is characterized by including.
机译:本发明涉及用于制造X射线掩模的硅湿法蚀刻的晶片吸盘。更具体地,本发明可以防止在X射线期间硅的湿法蚀刻期间晶片的外周接触蚀刻剂。掩膜制造工艺,或防止安装在晶圆一侧的设备与蚀刻剂接触。用于硅湿蚀刻的晶片吸盘。本发明的硅湿蚀刻晶片吸盘是用于X射线掩模制造的硅湿蚀刻晶片吸盘,其具有在截面上弯曲成L形的环形并且具有O形。 -在弯曲的平面中心的环(11)。下支撑部分10用于放置晶片50的一个表面的外周部分;并且,当具有环形的O形环(21)置于中央并安装在下支撑件10的弯曲表面上时,上支撑件20用于固定晶片50的另一表面的外周部分。其特点是包括。

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