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Electronic beam exposure device and resist application development device and resist pattern formation manner

机译:电子束曝光装置和抗蚀剂施加显影装置以及抗蚀剂图案形成方式

摘要

PROBLEM TO BE SOLVED: To minimize the time from application of resist to exposure, to make it even for every wafer and to keep the size of resist pattern constant. ;SOLUTION: An electron beam exposure system 1 is provided with an input device 11 which selects pattern data and various parameters from a pattern data file 14 and processes the data with a treatment time calculating means 12 which makes calculation with these data and parameters. The treatment time calculating means 12 is connected to a treatment time transferring means 13 so that the treatment time found by the treatment time calculating means 12 may be transmitted to a resist applying and developing device 2 in addition to wafer exchange. The resist applying and developing device 2 is provided with a data receiving means 21 and enables data transcription to a treatment time storing file 22.;COPYRIGHT: (C)1998,JPO
机译:要解决的问题:为了最大程度地减少从施加抗蚀剂到曝光的时间,甚至在每个晶片上也要做到这一点,并保持抗蚀剂图案的尺寸不变。电子束曝光系统1具有输入装置11,该输入装置11从图案数据文件14中选择图案数据和各种参数,并利用处理时间计算装置12对该数据进行处理,处理时间计算装置12利用这些数据和参数进行计算。处理时间计算装置12连接到处理时间传送装置13,从而除了晶片交换之外,可以将由处理时间计算装置12找到的处理时间传送到抗蚀剂施加和显影装置2。抗蚀剂涂布显影装置2具有数据接收装置21,并且能够将数据转录到治疗时间存储文件22。版权所有:(C)1998,JPO

著录项

  • 公开/公告号JP3156757B2

    专利类型

  • 公开/公告日2001-04-16

    原文格式PDF

  • 申请/专利权人 日本電気株式会社;

    申请/专利号JP19970071136

  • 发明设计人 平沢 聡美;

    申请日1997-03-25

  • 分类号H01L21/027;G03F7/027;G03F7/16;G03F7/20;H01L21/68;

  • 国家 JP

  • 入库时间 2022-08-22 01:33:32

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