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SEMICONDUCTOR DEVICE, ITS MANUFACTURING METHOD, AND RETICULE

机译:半导体器件,其制造方法和网状结构

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device capable of easily grasping the size of a resist pattern by an optical proximity effect even when the code pattern arrangement of a mask ROM is especially diversified and the number of code data of a cell part is enormously increased, a method for manufacturing the semiconductor device and a reticule. SOLUTION: A 7-points adjacent code pattern layer 23G and 8-points adjacent code pattern layer 23H of element patterns whose size dispersion due to the optical proximity effect is predicted out of code pattern layers to be element patterns formed in a ROM code area (main cell area) 20 are extracted, 7-points adjacent point measuring pattern layer 33G and 8-points adjacent point measuring pattern layer 33H having the same peripheral pattern arrangement are formed in a size measuring pattern arrangement area 30 to measure the size of the measuring pattern layers 33G, 33H.
机译:解决的问题:提供一种即使在特别是使掩模ROM的代码图案配置多样化,并且单元部的代码数据的数量极大的情况下,也能够通过光学接近效应容易地掌握抗蚀剂图案的尺寸的半导体装置。增加了用于制造半导体器件的方法和标线。 SOLUTION:元件图案的7点相邻代码图案层23G和8点相邻代码图案层23H被预测为从ROM代码区域中形成的元件图案(其图案由于光学邻近效应而引起的尺寸偏差)提取主单元区域20),在尺寸测量图案布置区域30中形成具有相同外围图案布置的7点相邻点测量图案层33G和8点相邻点测量图案层33H以测量测量尺寸图案层33G,33H。

著录项

  • 公开/公告号JP2003066588A

    专利类型

  • 公开/公告日2003-03-05

    原文格式PDF

  • 申请/专利权人 NEC MICROSYSTEMS LTD;

    申请/专利号JP20010255869

  • 发明设计人 OBARA AYUMI;

    申请日2001-08-27

  • 分类号G03F1/08;H01L21/027;H01L21/66;H01L21/8246;H01L27/112;

  • 国家 JP

  • 入库时间 2022-08-22 00:12:51

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