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Method of repairing an opaque defect in a photomask

机译:修复光掩模中的不透明缺陷的方法

摘要

A three-step method is used to repair an opaque defect in a photomask having a transparent substrate, and a light transmission portion disposed on the substrate and defining an opening the image of which is to be transferred to a layer on a semiconductor substrate. First, the thickness of the opaque defect is reduced by etching away only some of the defect. Second, a correction film is selectively formed over the entire surface of the substrate of the photomask in the opening defined by the light transmission portion with the exception of the region occupied by the pre-etched defect. Next, the correction film and the pre-etched defect are simultaneously etched away.
机译:使用三步法来修复具有透明衬底,以及光透射部分的光掩模中的不透明缺陷,该光掩模具有设置在该衬底上并限定开口的开口,该开口的图像将被转印到半导体衬底上的层上。首先,通过仅蚀刻掉一些缺陷来减小不透明缺陷的厚度。其次,在由光透射部分限定的开口中的光掩模的基板的整个表面上选择性地形成校正膜,除了被预蚀刻的缺陷占据的区域之外。接下来,校正膜和预先蚀刻的缺陷被同时蚀刻掉。

著录项

  • 公开/公告号US6506525B2

    专利类型

  • 公开/公告日2003-01-14

    原文格式PDF

  • 申请/专利权人 SAMSUNG ELECTRONICS CO. LTD.;

    申请/专利号US20010816364

  • 发明设计人 YO-HAN CHOI;JIN-MIN KIM;

    申请日2001-03-26

  • 分类号G03F90/00;

  • 国家 US

  • 入库时间 2022-08-22 00:06:28

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