Copper foil and its production manner null for etched circuit inner layer

摘要

PURPOSE: To provide a copper foil for a printed circuit inner layer which can improve the reliability on insulation between layers, and reduce the number of steps, and besides, improve the etching property of a fine circuit, and prevent the drop of the interlayer insulation caused by the reduction of the thickness of a board being requested of a multilayer and further, improve the adhesion between both sides of a copper foil at the same time, and its manufacture. ;CONSTITUTION: Fine knobs in the shape of reverse tears 0.6-1.0μm in length and 0.2-0.8μm in maximum diameter are provided on both sides of the copper foil 1-3μm in surface roughness.;COPYRIGHT: (C)1995,JPO