Diffusion Bonding of Tungsten to Copper and Its Alloy with Ti Foil and Ti/Ni/Ti Multiple Interlayers

摘要

Ti foil and Ti/Ni/Ti multiple interlayers were selected for the bonding of tungsten to copper and CuCrZr alloy. Theeffects of processing conditions on the microstructures and shear strength of the joints were investigated. When Tifoil is used for bonding of tungsten to pure copper but not transformed into liquid solution during the holding time,the strength of the joints is relatively low because of the multiple compound layers with brittleness formed in thebonding zone. The strength of the joints increases significantly if the Ti foil is transformed into liquid solution and ismostly extruded out of the bonding zone. The same phenomena are found in the case when Ti/Ni/Ti multi-interlayersare used for bonding tungsten to CuCrZr alloy.