首页> 外国专利> GLASS FOR SEMICONDUCTOR PACKAGE WINDOW, GLASS WINDOW FOR SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME, AND SEMICONDUCTOR PACKAGE

GLASS FOR SEMICONDUCTOR PACKAGE WINDOW, GLASS WINDOW FOR SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME, AND SEMICONDUCTOR PACKAGE

机译:用于半导体封装的玻璃窗,用于半导体封装的玻璃窗及其制造方法以及半导体封装

摘要

PROBLEM TO BE SOLVED: To provide glass for a window that can be preferably attached to a plastic semiconductor package and a glass window for the semiconductor package having various functions.;SOLUTION: The glass for a semiconductor package window is: (1) used for a window material of a plastic semiconductor package and the average coefficient of linear expansion at a temperature of 100 to 300°C is 120 to 180×10-7/°C; or (2) has the average coefficient of linear expansion and each contents of U and Th is less than or equal to 5ppb. Moreover, the glass for a semiconductor package window: (a) consists of the glass for a window; (b) is equipped with a lens function and has the average coefficient of linear expansion; or (c) has the average coefficient of linear expansion, and each contents of U and Th is less than or equal to 5ppb, consisting of glass containing Cu and phosphoric acid and the wavelength showing a transmittance of 50% is less than 630 nm in a spectral transmittance of the wavelength of 400 to 700 nm converted to a thickness of 0.5 mm.;COPYRIGHT: (C)2005,JPO&NCIPI
机译:解决的问题:提供一种可优选附接到塑料半导体封装的窗户玻璃和具有各种功能的半导体封装玻璃窗户。解决方案:半导体封装窗户玻璃是:(1)用于塑料半导体封装的窗材料,在100〜300℃的温度下的平均线膨胀系数为120〜180×10 Sup -7 Sup /℃。或(2)具有平均线性膨胀系数,并且U和Th的每个含量小于或等于5ppb。另外,半导体封装窗用玻璃:(a)由窗用玻璃构成; (b)具有镜片功能,并具有平均线性膨胀系数;或(c)具有线性平均膨胀系数,且U和Th的含量均小于或等于5ppb,由含Cu和磷酸的玻璃组成,且显示50%的透射率的波长小于630 nm。波长范围为400至700 nm的光谱透射率转换为厚度为0.5 mm .;版权所有:(C)2005,JPO&NCIPI

著录项

  • 公开/公告号JP2004327978A

    专利类型

  • 公开/公告日2004-11-18

    原文格式PDF

  • 申请/专利权人 HOYA CORP;

    申请/专利号JP20040111981

  • 发明设计人 HACHITANI YOICHI;

    申请日2004-04-06

  • 分类号H01L27/14;H01L23/02;H01L23/06;H01L23/08;

  • 国家 JP

  • 入库时间 2022-08-21 22:33:56

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