首页> 外国专利> SOIMOSFET AND MANUFACTURING METHOD OF SOIMOSFET

SOIMOSFET AND MANUFACTURING METHOD OF SOIMOSFET

机译:SOIMOSFET及其制造方法

摘要

A method of producing a SOI MOSFET which includes a fully depleted channel region of a first conductivity type formed in a top semiconductor layer disposed on an insulative substrate, source/drain regions of a second conductivity type formed to sandwich the channel region and a gate electrode formed on the channel region with intervention of a gate insulating film, the method comprises: forming the channel region by setting an impurity concentration of channel edge regions of the channel region adjacent to the source/drain regions higher than an impurity concentration of a channel central region of the channel region, and setting a threshold voltage Vth0 of the channel central region and a threshold voltage Vthedge of the channel edge regions so that a change of the threshold voltage Vth0 with respect to a change of the thickness of the top semiconductor layer and a change of the threshold voltage Vthedge with respect to the change of the thickness of the top semiconductor layer are of opposite sign. IMAGE
机译:一种SOI MOSFET的制造方法,该方法包括:在设置于绝缘基板上的顶部半导体层中形成的第一导电类型的完全耗尽的沟道区域;形成为将沟道区域夹在中间的第二导电类型的源/漏区域。该方法包括:在栅绝缘膜的干预下形成在沟道区上,该方法包括:通过将与源/漏区相邻的沟道区的沟道边缘区的杂质浓度设定为高于沟道中心的杂质浓度来形成沟道区。设置沟道中心区域的阈值电压Vth0和沟道边缘区域的阈值电压Vthedge,以使阈值电压Vth0相对于顶部半导体层的厚度的变化而变化。阈值电压Vthedge相对于顶部半导体层的厚度的变化是相反的标志。 <图像>

著录项

  • 公开/公告号KR100466061B1

    专利类型

  • 公开/公告日2005-01-13

    原文格式PDF

  • 申请/专利权人

    申请/专利号KR20020005851

  • 发明设计人 아단앨버트오스카;

    申请日2002-02-01

  • 分类号H01L29/78;

  • 国家 KR

  • 入库时间 2022-08-21 22:04:12

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号