ALKALI-SOLUBLE RESIN, POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INSULATING FILM, AND SEMICONDUCTOR DEVICE AND DISPLAY BODY DEVICE USING THE CURED FILM

摘要

PROBLEM TO BE SOLVED: To provide an alkali-soluble resin having high sensitivity, and having excellent heat resistance and reliability even when cured at low temperature when used as a positive photosensitive resin composition, to provide the positive photosensitive resin composition having high sensitivity, and having excellent heat resistance and reliability even when cured at low temperature, and to provide a cured film and the like, and a semiconductor device and the like using the cured film.;SOLUTION: The alkali-soluble resin contains a polybenzoxazole precursor structure constituted of a bis(aminophenol) and a structure originating from dicarboxylic acid. The difference is 37 [kcal/mol] or more between heat of formation of the most stable structure and heat of formation of the most unstable structure which are calculated and obtained by calculation chemistry when two aromatic rings of the bis(aminophenol) are rotated.;COPYRIGHT: (C)2009,JPO&INPIT